01
Semiconductor Packaging
Mechanical reliability of semiconductor packages, from warpage behavior to packaging materials.
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02
Thin Film Materials & Applications
Thin film mechanics across foldable displays, graphene, solar/fuel cells, polymers, and flexible electronics.
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03
Mechanical Reliability
Adhesion, warpage, and fatigue behavior of thin film materials and flexible electronics.
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04
Mechanical Property
Tensile, bending, and CTE measurement methods for thin films and flexible materials.
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05
Finite Element Method
Numerical simulation of bending, hygroscopic deformation, and adhesion to guide reliable design.
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06
Manufacturing Method
Nanofilm transfer and rolling methods for assembling free-standing thin films.
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