Research Areas
Semiconductor Packaging
Mechanical reliability of semiconductor packages, from warpage behavior to packaging materials.
Mechanical Reliability of Semiconductor Packaging
With development of advanced packaging technologies to improve the performance of electronic devices, mechanical reliability issues are arisen together. Our group focuses on the researches about mechanical reliability of semiconductor packages.
Package Structures – Warpage Analysis
Warpage behavior in semiconductor packages can cause various mechanical reliability issues. Moreover, advanced packaging technologies, such as heterogeneous integration, have made warpage behavior increasingly complex. Therefore, precise analysis of warpage behavior is essential for ensuring the mechanical reliability of semiconductor packages. Our research group has developed modeling approaches to describe the nonlinear warpage behavior that occurs during the manufacturing processes of high bandwidth memory (HBM) and fan-out wafer-level packaging (FOWLP). In addition, we have investigated the deformation mechanisms of some semiconductor structures, such as copper clad laminate (CCL) and molded wafer.
Nonlinear warpage modeling for HBM and FOWLP manufacturing processes
Molded wafer
Copper clad laminate (CCL)
Packaging Materials – Mechanical / Thermo-Mechanical / Hygro-Mechanical behavior
Semiconductor package are consist of various packaging materials. Different behavior of various packaging materials cause complex warpage behavior and stress distribution of semiconductor packages. Therefore, mechanical properties and behavior should be accurately measured to design mechanically reliable package structures. In our research group, mechanical, thermo-mechanical, and hygroscopic properties of epoxy-based packaging materials and thinned silicon was accurately measured by digital image correlation (DIC) method. Also, interfacial adhesion energy between different packaging materials was measured by double cantilever beam (DCB) test.