2026
297.
AI-assisted Full-field Warpage Prediction and Optimization for Advanced Packaging
J. Lee, S.-W. Lee, T.-S. Kim, D. Kwon* · IEEE Transactions on Components, Packaging and Manufacturing Technology, accepted, 2026 · Link ↗
296.
Hybrid auxetic metamaterial platforms enabling multiscale isotropic expansion for distortion-free stretchable displays
S.-B. Kim+, J. Kim+, S. Kim, D. Choi, C.-Y. Gu, T.-S. Kim, H. Moon*, S. Yoo* · Nature Communications, 17, 7389, 2026 · Link ↗
295.
Importance of Molecular Weight of Conjugated Polymer Thin Films on Thermo-mechanical Reliability of Stretchable Organic Semiconductors
D. J. Kim, J.-W.Lee, K.Bae, T. Y. Kang, B. S. Ma, B. J. Kim, T.-S. Kim · Chemistry of Materials, accepted, 2026 · Link ↗
294.
Deep Learning-Enabled Multiscale Strategy for Rapid and Accurate Warpage Prediction of Interposer Routing Interconnects
C. Yang, M. Oh, M. G. Park, W. Choi, M. S. Ju, H. Song*, S. K. Lim*, T.-S. Kim* · International Journal of Precision Engineering and Manufacturing-Green Technology, 1-14, 2026 · Link ↗
293.
Knowledge-guided strain-damage image correlation for diagnosing nonlinear mechanical behavior of freely stretched ultra-thin polymer films on water surface
M. Song, S. J. Oh, S. Suh, T. Y. Kang*, and T.-S. Kim* · Polymer Testing, 109154, 2026 · Link ↗
292.
Effect of W nucleation process on the adhesion of W/TiN/SiO2 structures for BEOL interconnects
S. W. Lee+, D. J. Kim+, J. Jeon, T.-S. Kim* · Applied Surface Science, 736, 166754, 2026 · Link ↗
291.
Direct Growth of Transparent Boron Nitride Neutron Shielding Layer for Space Window
D. Kim, G. Kim, H. Jeong, S. M. Hossain, S. Bhattacharjee, M. J. Kwon, Y. Lee, C. Yang, Y. S. Ham, T.-S. Kim, H. Moon, I. Park, S.-C. Lee, J. Kim, J. Kim, J. Park* · Advanced Science, e16390, 2026 · Link ↗
290.
Strain-Induced Detectivity Enhancement in Intrinsically Stretchable Organic Photodetectors
H. Jeon, J. Oh, J.-W. Lee, H. J. Eun, W. J. Kang, D. H. Ryu, C. E. Song, C. Wang, H. Kang, T.-S. Kim, J. H. Kim, S. Lee*, B. J. Kim* · Advanced Materials, e14951, 2026 · Link ↗
289.
Nonlinear Warpage Modeling of Dielectric-Controlled Carrier Wafers
C.-Y. Gu, M. H. Choi, M. S. Ju, D. Kim, S. Ma, T.-I. Lee*, and T.-S. Kim* · International Journal of Mechanical Sciences, 314(15), 111361, 2026 · Link ↗
287.
Fluorinated Elastomeric Protective Layers with Controlled Solvophobic Properties for Stable Operation of Lithium Metal Batteries
S. H. Kwon, H. Jo, J. Han, Y. S. Ham, T.-S. Kim, M. J. Lee, H.-H. Cho, J. Park*, and B. J. Kim* · ACS Energy Letters, 2026 · Link ↗
285.
Study on the interfacial reactions between In-Ag alloys and electroless nickel-immersion gold metallization
Y. Sim, J. Maeng, M. Oh, W. Choi, T.-S. Kim, E. Hur, Y. Sohn* · Soldering & Surface Mount Technology, 1-9, 2026 · Link ↗
2025
288.
Tailored n-Value Engineering of Dion-Jacobson 2D Layers Enables Efficient and Stable Perovskite Solar Cells
J. Lee+, C. S. Moon+, Y. Kim, Y. Y. Kim, E. Y. Park, J. J. Yoo, G. Kim, E. S. Oh, T.-S. Kim, S. Song, T. J. Shin, J. H. Noh, N. J. Jeon*, and J. Seo* · Joule, 2025 · Link ↗
286.
Stabilization of Electrical Instabilities in Flexible Textile-Based 2T1C Pixel Circuits with a Bottom Shield Metal Structure
J. Park, C.-Y Gu, J. Lee, M. Kim, S. Park, T.-S. Kim*, and K. C. Choi* · ACS Applied Materials & Interfaces, 17, 52, 70690–70702, 2025 · Link ↗
284.
Effect of Nucleation-Stage Reducing Agents on Residual Stress in CVD Tungsten Thin Films
D. J. Kim, S. W. Lee, H. Lee, and T.-S. Kim* · IEEE Transactions on Materials for Electron Devices, vol. 3, pp. 1-7, 2025 · Link ↗
283.
Truly Wearable OLEDs with Moisture Impermeable and Flexible Textile Substrate Based on Mechanical Analysis of Textile Directionality: Toward Real Cloth-Type Display
Y. Na, S. Y. Jeong, S. J. Oh, H.-E. Cho, S. Choi, K. S. Kang, Y. Jeon, T.-S. Kim, and K. C. Choi* · Applied Electronics Materials, 7, 9329−9338, 2025 · Link ↗
282.
Dual-Percolative Planar-Heterojunction Photoactive System for High-Performance Stretchable Organic Photovoltaics Enhancing Power Output Under Strain
J.-W. Lee†, K. Bae†, D. J. Kim, S. Lee, S. Lee, J.-Y. Lee, T.-S. Kim, and B. J. Kim* · Advanced Functional Materials, e23048, 2025 · Link ↗
281.
Boric acid-mediated sol–gel construction of transparent, photoactive TiO2 films
S.Y. Rhee, D.T. Nguyen, S.Y. Han, K. Klementiev, W. Youn, G. Yun, Y. Kwon, S.W. Han, J.H. Kim, T.-S. Kim, V.G. Kessler, H. Lee, G.A. Seisenbaeva and I.S. Choi · Chemical Communications, 2025 · Link ↗
280.
Prevention of Frost-Driven Self-Fracture of Ionomer-Bound Carbon Films by Controlling Freezable Water Domain Size
J.-B. Pyo+*, J. H. Kim+, and T.-S. Kim* · Carbon Energy, e70098, 2025 · Link ↗
279.
Simultaneous Quantitative Analysis of Large-Area Warpage and Local In-Plane Strain Using 3D-DIC and Stitching Techniques
C.-Y. Gu, M. Oh, W. Choi, Y. S. Ham, G.-H. Ju, Y.-H. Yi, J.-H. Lee, and T.-S. Kim* · J. Microelectron. Packag. Soc., 32(2), pp93-99, 2025 · Link ↗
278.
Hydrogel electronic materials and microfabrication processes for soft electronic applications
D. Won+, H. J. Kim+, T.-S. Kim*, and S. H. Ko* · Appl. Phys. Rev., 12, 031302 (Featured article), 2025 · Link ↗