Advanced Packaging and Thin Films Lab
We investigate adhesion, deformation, fracture, and fatigue in advanced semiconductor packaging and functional thin films — from HBM to flexible and electronic devices.
Google Scholar ↗About the Lab
Our research group focuses on mechanics-related subjects of advanced packaging and thin films: adhesion, deformation, fracture, fatigue, reliability, and stress-strain-induced multiphysics phenomena for the following applications.
Microelectronics (HBM, NAND flash, DRAM, and other semiconductor packages), flexible display, fuel cell, solar cell, battery, electronic packaging, encapsulation, dry transfer, tensile / bending / folding / adhesion tests.
Research Areas
Six directions bridging mechanics and microelectronics.
Semiconductor Packaging
Mechanical reliability of semiconductor packages, from warpage behavior to packaging materials.
Thin Film Materials & Applications
Thin film mechanics across foldable displays, graphene, solar/fuel cells, polymers, and flexible electronics.
Mechanical Reliability
Adhesion, warpage, and fatigue behavior of thin film materials and flexible electronics.
Mechanical Property
Tensile, bending, and CTE measurement methods for thin films and flexible materials.
Finite Element Method
Numerical simulation of bending, hygroscopic deformation, and adhesion to guide reliable design.
Manufacturing Method
Nanofilm transfer and rolling methods for assembling free-standing thin films.
Publications
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We are always looking for motivated graduate and undergraduate students interested in the advanced packaging and thin films. Please contact us for opportunities.