Research Areas

Numerical simulation of bending, hygroscopic deformation, and adhesion to guide reliable design.

Research background

Finite Element Method(FEM) is a numerical method that calculating deformation by discretizing model into several elements. For understanding mechanisms and explanation of phenomenon, simulating mechanical deformation is important. Moreover, stress and strain results from Finite Element Method are used to improve reliability of various systems.

Bending Analysis

Stress analysis of assembled Chip-in-Flex packages for wearable electronics application

Hygroscopic Deformation

Warpage of flexible polymer substrates

Adhesion

Modulus effect of adhesive Cu/Graphene interfacial adhesion