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92.
S. Jang, C. Kim, J. J. Park, M. L. Jin, S. J. Kim, O O. Park, T.-S. Kim and H.-T Jung*, “A high aspect ratio serpentine structure for use as a strain-insensitive, stretchable transparent conductor”, Small, 2017 (accepted).
91.
H. J. Han, J. W. Jeong, S. R. Yang, C. Kim, H. G. Yoo, J.-B. Yoon, J. H. Park, K. J. Lee, T.-S. Kim, S.-W. Kim, and Y.S. Jung*, “Nanotransplantation Printing of Crystallographic-Orientation-Controlled Single-Crystalline Nanowire Arrays on Diverse Surfaces”, ACS Nano, DOI: 10.1021/acsnano.7b06696, 2017.
90.
Y. S. Oh, H. Choi, J. Lee, H. Lee, D. Y. Choi, S.-U. Lee, K.-S. Yun, S. Yoo, T.-S. Kim, I. Park*, and H. J. Sung*, “Temperature-Controlled Direct Imprinting of Ag Ionic Ink: Flexible Metal Grid Transparent Conductors with Enhanced Electromechanical Durability”, Scientific Reports, 7, 11220, 2017.
89.
I. Lee, J. Noh, J.-Y. Lee*, and T.-S. Kim*, “Co-optimization of Adhesion and Power Conversion Efficiency of Organic Solar Cells by Controlling Surface Energy of Buffer Layers”, ACS Applied Materials & Interfaces, DOI10.1021/acsami.7b10398, 2017.
88.
S.-Y. Kim, J.H. Bong, C. Kim, W.S. Hwang, T.-S. Kim, B.J. Cho*, “Mechanical Stability Analysis via Neutral Mechanical Plane for High-Performance Flexible Si Nanomembrane FDSOI Device”, Advanced Materials Interfaces , DOI: 10.1002/admi.201700618, 2017.
87.
J.-H. Kim, T.-I. Lee, T.-S. Kim, K.-W. Paik*, “The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications”, IEEE Trans. Compon., Packag., Manuf. Technol., 7(10), 1583-1591, 2017.
86.
W. Jo, J. Seo, and T.-S. Kim*, “Manufacturing of Metal Micro-wire Interconnection on Submillimeter Diameter Catheter”, Journal of the Microelectronics and Packaging Society, 24(2), 29-35, 2017.
85.
T.-I. Lee, C. Kim, J.-B. Pyo, M.S. Kim*, and T.-S. Kim*, “Effect of Anisotropic Thermo-Elastic Properties of Woven-Fabric Laminates on Diagonal Warpage of Thin Package Substrates”, Composite Structures, 176, 973-981, 2017.
84.
C. Kim, T.-I. Lee, M.S. Kim*, and T.-S. Kim*, “Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing”, Microelectronics Reliability, 73, 136-145, 2017.
83.
T. Yoon, T.-S. Kim*, “Thermo-Mechanical Reliability of TSV based 3D-IC”, Journal of the Microelectronics and Packaging Society, 24(1), 35-43, 2017.
82.
J. Park, S. Han, D. Kim, B. You, S. Hong, J. Seo, J. Kwon, C. Jeong, H. Park, T.-S. Kim, S. Ko*, K. Lee*, “Plasmonic-Tuned Flash Cu Nanowelding for Ultrafast Photochemical-Reducing and Interlocking on Flexible Plastics”, Advanced Functional Materials, 1701138, 2017.
81.
W. Kim, I. Lee, D.-Y. Kim, Y.-Y. Yu, H.-Y. Jung, S. Kwon, W.-S. Park, T.-S. Kim*, “Controlled multiple neutral planes by low elastic modulus adhesive for flexible organic photovoltaics”, Nanotechnology, 28, 194002, 2017.
80.
J.-H. Kim, J. Noh, H. Choi, J.-Y. Lee*, T.-S. Kim*, “Mechanical Properties of Polymer-Fullerene Bulk Heterojunction Films: Role of Nanomorphology of Composite Films”, Chemistry of Materials, 29(9), 3954-3961, 2017.
79.
H. J. Kim, M. Y. Lee, J.-S. Kim, J.-S. Kim, J.-H. Kim, H. Yu, H. Yun, K. Liao, T.-S. Kim*, J. H. Oh*, B. J. Kim*, “Solution-Assembled Blends of Regioregularity Controlled Polythiophenes for Coexistence of Mechanical Resilience and Electronic Performance”, ACS Applied Materials & Interfaces, 9(16), 14120-14128, 2017.
78.
J. Kim, C. Kim, Y. Song, S.-G. Jeong, T.-S. Kim*, C.-S. Lee*, “Reversible Self-Bending Soft Hydrogel Microstructures with Mechanically Optimized Designs”, Chemical Engineering Journal, 321, 384-393, 2017.
77.
Y. Kim, T. Yoon, T.-W. Kim, T.-S. Kim, K.-W. Paik*, “Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn-Ag Microbump”, IEEE Trans. Compon., Packag., Manuf. Technol., 7(3), 371-378, 2017.
76.
K.-L. Jang, S. Kim, B.-H. Jeong, J.-G. Oh, B. K. Hong*, T.-S. Kim*, “Electromechanical diagnostic method for monitoring cracks in polymer electrolyte fuel cell electrodes”, International Journal of Hydrogen Energy, 42(16), 11644-11653, 2017.
75.
D. Rodriquez, J.-H. Kim, S. E. Root, Z. Pei, P. Boufflet, M. Heeney, T.-S. Kim*, D. J. Lipomi*, “Comparison of Methods for Determining the Mechanical Properties of Semiconducting Polymer Films for Stretchable Electronics”, ACS Applied Materials & Interfaces, 9(10), 8855-8862, 2017.
74.
I. Lee, J. H. Yun, H. J. Son, T.-S. Kim*, “Accelerated Degradation Due to Weakened Adhesion from Li-TFSI Additives in Perovskite Solar Cells”, ACS Applied Materials & Interfaces, 9(8), 7029-7035, 2017.
73.
J.-H. Kim, I. Lee, T.-S. Kim*, N. Rolston, B. L. Watson, and R. H. Dauskardt*, “Understanding mechanical behavior and reliability of organic electronic materials”, MRS Bulletin, 42(2), 115-123, 2017.
72.
M. Yang, Y.-H. Ko, J. Bang, T.-S. Kim, C.-W. Lee*, S. Zhang, M. Li*, “Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates”, Journal of Alloys and Compounds, 701, 533-541, 2017.
71.
M. Yang, Y.-H. Ko, J. Bang, T.-S. Kim, C.-W. Lee*, M. Li*, “Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate”, Materials Characterization, 124, 250-259, 2017.
70.
J.H. Bong, C. Kim, W.S. Hwang, T.-S. Kim*, and B.J. Cho*, “A Quantitative Strain Analysis of a Flexible Single-Crystalline Silicon Membrane”, Applied Physics Letters, 110(3), 033105, 2017.
69.
J.-W. Seo, M. Joo, J. Ahn, T.-I. Lee, T.-S. Kim, S. G. Im*, and J.-Y. Lee*, “Facilitated Embedding of Silver Nanowires into Conformally-Coated iCVD Polymer Films Deposited on Cloths for Robust Wearable Electronics”, Nanoscale, 9(10), 3399-3407, 2017.
68.
J. H. Park, G.-T. Hwang, S. Kim, J. Seo, H.-J. Park, K. Yu, T.-S. Kim, and K.-J. Lee*, “Flash-Induced Self-Limited Plasmonic Welding of Silver Nanowire Network for Transparent Flexible Energy Harvester”, Advanced Materials, 29(5), 1603473, 2017.
67.
T.-I. Lee, C. Kim, M.S. Kim*, and T.-S. Kim*, “Measurement of Flexural Modulus of Lamination Layers on Flexible Substrates ”, Journal of the Microelectronics & Packaging Society, 23(3), 63-67, 2016.
66.
T.-W. Kim, T.-I. Lee, Y. Pan, W. Kim, S. Zhang, T.-S. Kim, and K.-W. Paik*, “Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly”, IEEE Trans. Compon., Packag., Manuf. Technol., 6(9), 1317-1329, 2016.
65.
C. Kim, T.-I. Lee, and T.-S. Kim*, “Measurement Technologies of Mechanical Properties of Polymers used for Flexible and Stretchable Electronic Packaging”, Journal of the Microelectronics & Packaging Society, 23(2), 19-28, 2016.
64.
Y.-H. Ko, K. Choi, S. W. Kim, D.-Y. Yu, J. Bang, and T.-S. Kim*, “Trends of Researches and Technologies of Electronic Packaging Using Graphene”, Journal of the Microelectronics & Packaging Society, 23(2), 1-10, 2016.
63.
J. Ahn, J.-W. Seo, T.-I. Lee, D. Kwon, I. Park, T.-S. Kim, and J.-Y. Lee*, “Extremely Robust and Patternable Electrodes for Copy-Paper-Based Electronics”, ACS Applied Materials & Interfaces, 19031-19037, 2016.
62.
S. Jang, W. -B. Jung, C. Kim, P. Won, S.-G. Lee, K. M. Cho, M. L. Jin, C. J. An, H.-J. Jeon, S. H. Ko, T.-S. Kim, and H.-T. Jung*, “A three-dimensional metal grid mesh as a practical alternative to ITO”, Nanoscale, 14257-14263, 2016.
61.
D. Kwon, T.-I. Lee, J. Shim, S. Ryu, M. S. Kim, S. Kim, T.-S. Kim, I. Park*, “Highly Sensitive, Flexible and Wearable Pressure Sensor Based on a Giant Piezocapacitive Effect of Three-Dimensional Microporous Elastomeric Dielectric Layer”, ACS Applied Materials & Interfaces, 16922-16931, 2016.
60.
J. Lee, T.-H. Han, M.-H. Park, Y. Jung, J. Seo, H.-K. Seo, H. Cho, E. Kim, J. Chung, S.-Y. Choi, T-S. Kim, T.-W. Lee*, and S. Yoo*, “Synergetic electrode architecture for efficient graphene-based flexible organic light-emitting diodes”, Nature Communications, 7, 11791, 2016.
59.
T.-I. Lee, C. Kim, M.S. Kim*, and T.-S. Kim*, “Flexural and Tensile Moduli of Flexible FR4 Substrates”, Polymer Testing, 53, 70-76, 2016.
58.
S. Kim, J.-H. Kim, J.-G. Oh, K.-L. Jang, B.-H. Jeong, B.K. Hong*, and T.-S. Kim*, “Mechanical Behavior of Free-Standing Fuel Cell Electrodes on Water Surface”, ACS Applied Materials & Interfaces, 15391-15398, 2016.
57.
J.-B. Pyo, T.-I. Lee, C. Kim, M.S. Kim*, and T.-S. Kim*, “Prediction of time-dependent swelling of flexible polymer substrates using hygro-mechanical finite element simulations”, Soft Matter, 12, 4135-4141, 2016.
56.
M.S. Oh, Y.S. Song, C. Kim, J. Kim, J.B. You, T.-S. Kim, C.-S Lee*, and S.G. Im*, “Control of Reversible Self-Bending Behavior in Responsive Janus Microstrips”, ACS Applied Materials & Interfaces, 8782-8788, 2016.
55.
T.-I. Lee, M.S. Kim*, and T.-S. Kim*, “Contact-Free Thermal Expansion Measurement of Very Soft Elastomers using Digital Image Correlation”, Polymer Testing, 51, 181-189, 2016.
54.
Y.-H. Ko, J.-D. Lee, T. Yoon, C.-W. Lee, and T.-S. Kim*, “Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene”, ACS Applied Materials & Interfaces, 8 (8), 5679–5686, 2016.
53.
J.-H. Kim, T.-I. Lee, J.-W. Shin, T.-S. Kim, and K.-W. Paik*, “Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications”, IEEE Trans. Compon., Packag., Manuf. Technol., 6(2), 208-215, 2016.
52.
Y.-L. Kim, T.-I. Lee, J.-H. Kim, W. Kim, T.-S. Kim, and K.-W. Paik*, “Effects of the Mechanical Properties of Polymer Resin and the Conductive Ball Types of Anisotropic Conductive Films on the Bending Properties of Chip-in-Flex Package”, IEEE Trans. Compon., Packag., Manuf. Technol., 6(2), 200-207, 2016.
51.
T. Yoon, J.-H. Kim, J.H. Choi, D.Y. Jung, I.-J. Park, S.-Y. Choi, N.S. Cho, J.-I. Lee, Y.-D. Kwon, S. Cho, and T.-S. Kim*, “Healing Graphene Defects using Selective Electrochemical Deposition: Toward Flexible and Stretchable Devices,” ACS Nano, 10, 1539-1545, 2016.
50.
I. Lee, G. W. Kim, M. Yang, and T.-S. Kim*, “Simultaneously Enhancing the Cohesion and Electrical Conductivity of PEDOT:PSS Conductive Polymer Films using DMSO Additives,” ACS Applied Materials & Interfaces, 8(1), 302-310, 2016.
49.
S.-H. Kim, H. R. Lee, S. J. Yu, M.-E. Han, D. Y. Lee, S. Y. Kim, H.-J. Ahn, M.-J. Han, T.-I. Lee, T.-S. Kim, S. K. Kwon*, S.-G. Im*, N. S. Hwang*, “Hydrogel-laden paper scaffold system for origami-based tissue engineering,” Proc. Natl. Acad. Sci., 1504745112, 2015.
48.
H. Eom, J.-H. Kim, J. Hur, T.-S. Kim, S.-K. Sung, J.-H. Choi, E. Lee, J.-H. Jeong*, and I. Park*, “Nanotextured Polymer Substrate for Flexible and Mechanically Robust Metal Electrodes by Nanoimprint Lithography”, ACS Applied Materials & Interfaces, 7, 25171-25179, 2015.
47.
Y.-H. Lee, Y. Kim, T.-I. Lee, I. Lee, J. Shin, H. S. Lee, T.-S. Kim, and J. W. Choi*, “Anomalous Stretchable Conductivity Using an Engineered Tricot Weave”, ACS Nano, 9 (12), 12214–12223, 2015.
46.
T. Kim, J.-H. Kim, T. E. Kang, C. Lee, H. Kang, M. Shin, C. Wang, B. Ma, U. Jeong, T.-S. Kim*, and B. J. Kim*, "Flexible, Highly Efficient All-Polymer Solar Cells", Nature Communications, 6, 8547, 2015.
45.
J. H. Yun, I. Lee, T.-S. Kim, M. J. Ko, J. Y. Kim, and H. J. Son*, “Synergistic enhancement and mechanism study of mechanical and moisture stability of perovskite solar cells introducing polyethylene-imine into the CH3NH3PbI3/HTM interface,” Journal of Materials Chemistry A, 3, 22176, 2015.
44.
J.-H. Kim, K.-S. Kim, K.-R. Jang, S.-B. Jung*, and T.-S. Kim*, “Enhancing Adhesion of Screen-Printed Silver Nanopaste Films,” Advanced Materials Interfaces, 2, 1500283, 2015.
43.
J.-S. Kim, J.-H. Kim, W. Lee, H. Yu, H. J. Kim, I. Song, M. Shin, J. H. Oh, U. Jeong, T.-S. Kim*, and B. Kim*, “Tuning Mechanical and Opto-Electrical Properties of Poly(3-hexylthiophene) through Systematic Regioregularity Control,” Macromolecules, 48, 4339-4346, 2015.
42.
C. Kim, T.-I. Lee, M.S. Kim*, and T.-S. Kim*, “Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates,” Polymers, 7(6), 985-1004, 2015.
41.
Y.-H. Ko, M.-S. Kim, J. Bang, T.-S. Kim, and C.-W. Lee*, “Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate,” Journal of Electronic Materials, 44 (7), 2458-2466, 2015.
40.
C.-C. Yu, S. Kim, J. D. Baek, Y. Li, P.-C. Su*, and T.-S. Kim*, “Direct Observation of Nanoscale Pt Electrode Agglomeration at the Triple Phase Boundary,” ACS Applied Materials & Interfaces, 7(11), 6036-6040, 2015.
39.
Y. K. Jeong, T.-w. Kwon, I. Lee, T.-S. Kim, A. Coskun*, and J. W. Choi*, “Millipede-inspired Structural Design Principles for High Performance Polysaccharide Binders in Silicon Anodes,” Energy and Environmental Science, 8, 1224-1230, 2015.
38.
D. J. Kang, H.-H. Cho, I. Lee, K.-H. Kim, H. J. Kim, K. Liao, T.-S. Kim, and B. J. Kim*, “Enhancing Mechanical Properties of Highly Efficient Polymer Solar Cells Using Size-Tuned Polymer Nanoparticles,” ACS Applied Materials & Interfaces, 7, 2668-2676, 2015.
37.
J. Seo, W. S. Chang, and T.-S. Kim*, “Adhesion Improvement of Graphene/Copper Interface using UV/Ozone Treatments,” Thin Solid Films, 584, 170-175, 2015.
36.
T.-w. Kwon, Y. K. Jeong, I. Lee, T.-S. Kim, J. W. Choi*, and A. Coskun*, “Systematic Molecular-Level Design of Binders Incorporating Meldrum`s Acid for Silicon Anodes in Lithium Rechargeable Batteries,” Advanced Materials, 26, 7979-7985, 2014.
35.
H. J. Kim, J.-H. Kim, J.-H. Ryu, Y. Kim, H. Kang, W. B. Lee, T.-S. Kim*, and B. J. Kim*, “Architectural Engineering of Rod-Coil Compatibilizers for Producing Mechanically and Thermally Stable Polymer Solar Cells,” ACS Nano, 8(10), 10461-10470, 2014.
34.
S. Kim, B.-H. Jeong, B. K. Hong*, and T.-S. Kim*, “Effects of hydrophobic agent content in macro-porous substrates on the fracture behavior of the gas diffusion layer for proton exchange membrane fuel cells,Journal of Power Sources, 270, 342-348, 2014.
33.
T. Yoon, W. S. Jo, and T.-S. Kim*, “High-Yield Etching-Free Transfer of Graphene: A Fracture Mechanics Approach,” Journal of the Microelectronics & Packaging Society, 21(2), 59-64, 2014.
32.
I. Lee and T.-S. Kim*, “Thermal Assisted UV-Ozone Treatment to Improve Reliability of Ag Nanoparticle Thin Films,” Journal of the Microelectronics & Packaging Society, 21(1), 41-44, 2014.
31.
J.-S. Kim, Y.-H. Lee, I. Lee, T.-S. Kim, M.-H. Ryou*, and J. W. Choi*, “Large Area Multi-stacked Lithium-ion Batteries for Flexible and Rollable Applications,” Journal of Materials Chemistry A, 2, 10862-10868, 2014.
30.
S. Kim and T.-S. Kim*, “Adhesion improvement of silicon/underfill/polyimide interfaces by UV/ozone treatment and sol-gel derived hybrid layers,” Microelectronics Reliability, 54, 833-839, 2014.
29.
Y. K. Jeong, T.-w. Kwon, I. Lee, T.-S. Kim, A. Coskun*, and J. W. Choi*, “Hyperbranched β-Cyclodextrin Polymer as an Effective Multidimensional Binder for Silicon Anodes in Lithium Rechargeable Batteries,” Nano Letters, 14, 864-870, 2014.
28.
W. Jung, T. Yoon, J. Choi, S. Kim, Y. Kim*, T.-S. Kim* and C. Han*, “Superstrong encapsulated monolayer graphene by the modified anodic bonding,” Nanoscale, 6, 547-554, 2014.
27.
T. Yoon, J. Moon, B. Cho*, and T.-S. Kim*, “Penetration and Lateral Diffusion Characteristics of Polycrystalline Graphene Barriers,” Nanoscale, 6, 151-156, 2014. (selected for "This week's HOT articles")
26.
W. Jung, J. Park, T. Yoon, T.-S. Kim, S. Kim* and C. Han*, “Prevention of water permeation by strong adhesion between graphene and SiO2 substrate,” Small, 10(9), 1704-1711, 2014.

25.

Y. Lee, J. Kim, J. Noh, I. Lee, H. Kim, S. Choi, J. Seo, M. Kim, S. Jeon, T.-S. Kim*, J. Lee*, and J. Choi*, “Wearable textile battery rechargeable by solar energy,” Nano Letters, 13(11), 5753-5761, 2013.

-The Most Read Article in Nano Letters in November 2013
-Featured in Nature [Link
-Selected as one of top 10 power management news in EE times Europe [Link]

24.
W.C. Shin, T. Yoon, J.H. Mun, T.Y. Kim, S.Y. Choi, T.-S. Kim* and B.J. Cho*, “Doping suppression and mobility enhancement of graphene transistors fabricated using an adhesion promoting dry transfer process,” Applied Physics Letters, 103, 243504, 2013.
23.
C. Lee, J.-H. Kim, C. Zou, I. Cho, J. Weisse, W. Nemeth, Q. Wang, A. van Duin, T.-S. Kim*, and X. Zheng* “Peel-and-Stick: Mechanism Study for Efficient Fabrication of Flexible/Transparent Thin-film Electronics,” Scientific Reports, 3, 2917, 2013.
22.
J.-H. Kim, A. Nizami, Y. Hwangbo, B. Jang, H. Lee, C. Woo, S. Hyun*, and T.-S. Kim*, “Tensile Testing of Ultra-Thin Films on Water Surface,” Nature Communications, 4, 2520, 2013.
21.
I. Lee, J. Lee, S. Ko*, and T.-S. Kim*, “Reinforcing Ag Nanoparticle Thin Films by Very Long Ag Nanowires,” Nanotechnology, 24, 415704, 2013.
20.
J. Hwang, T. Yoon, S. Jin, J. Lee, T.-S. Kim, S. Hong*, and S. Jeon*, “Enhanced Mechanical Properties of Graphene/Copper Nanocomposites Using a Molecular-Level Mixing Process,” Advanced Materials, 25, 6724-6729, 2013. (Received the 2014 KINC Fusion Research Award)
19.
J. Lee, P. Lee, H. Lee, S. Hong, I. Lee, J. Yeo, S. Lee, T.-S. Kim, D. Lee*, and S. Ko*, "Room-Temperature Nanosoldering of a Very Long Metal Nanowire Network by Conducting-Polymer-Assisted Joining for a Flexible Touch-Panel Application," Advanced Functional Materials, 23(34), 4171-7176,2013. (front cover)
18.
J. Lee, I. Lee, T.-S. Kim, and J.-Y. Lee*, "Efficient Welding of Silver Nanowire Networks without Post-Processing," Small, 9(17), 2887-2894, 2013.

17.
Y. Ko, M. Kim, T.-S. Kim, J. Bang, and C. Lee*, “Study on Joint of Micro Solder Bump for Application of Flexible Electronics,” Journal of the Korean Welding and Joining Society, 31(3), 4-10, 2013.
16.
C. Kim, H. Choi, M. Kim, and T.-S. Kim*, “Packaging Substrate Bending Prediction due to Residual Stress,” Journal of the Microelectronics and Packaging Society, 20(1), 21-26, 2013.
15.
M.-H. Ryou, J. Kim, I. Lee, S. Kim, Y. K. Jeong, S. Hong, J. H. Ryu, T.-S. Kim, J.-K. Park*, H. Lee*, J. W. Choi*, "Mussel-Inspired Adhesive Binders for High-Performance Silicon Nanoparticle Anodes in Lithium-Ion Batteries ," Advanced Materials, 25(11), 1571-1576, 2013. (frontpiece article)
14.
S. Kim and T.-S. Kim*, “Adhesion Reliability Enhancement of Silicon/Epoxy/Polyimide Interfaces for Flexible Electronics,” Journal of the Microelectronics and Packaging Society, 19(3), 63-69, 2012.
13.
Y. Ko, T.-S. Kim, Y. Lee, S. Yoo, and C. Lee*, “Reliability of High Temperature and Vibration in Sn3.5Ag and Sn0.7Cu Lead-free Solders," Journal of the Microelectronics and Packaging Society, 19(3), 31-36, 2012.
12.
I. Lee, S. Kim, J. Yun, I. Park*, and T.-S. Kim*, “Interfacial toughening of solution processed Ag nanoparticle thin films by organic residuals,”Nanotechnology, 23, 485704, 2012.
11.
T.-S. Kim*, “Adhesion Measurement Methods for Thin Films in Microelectronics,” Journal of the Korean Welding and Joining Society, 30(3), 213-218, 2012.
10.
T. Yoon, W. C. Shin, T. Y. Kim, J. H. Mun, T.-S. Kim*, and B. J. Cho*, "Direct Measurement of Adhesion Energy of Monolayer Graphene As-Grown on Copper and Its Application to Renewable Transfer Process," Nano Letters, 12(3), 1448-1452, 2012. (Supporting Information)
9.
T.-S. Kim and R. H. Dauskardt, "Molecular Mobility under Nanometer Scale Confinement," Nano Letters, 10(5), 1955-1959, 2010.
8.
T.-S. Kim and R. H. Dauskardt*, "Integration Challenges of Nanoporous Low Dielectric Constant Materials," IEEE Transactions on Device and Materials Reliability, 9(4), 509-515, 2009.
7.
T.-S. Kim, D. Chumakov, E. Zschech, and R. H. Dauskardt*, "Tailoring UV cure depth profiles for optimal mechanical properties of organosilicate thin films," Applied Physics Letters, 95, 071902, 2009.
6.
T.-S. Kim, T. Konno, and R. H. Dauskardt*, "Surfactant-Controlled Damage Evolution during Chemical Mechanical Planarization of Nanoporous Films," Acta Materialia, 57, 4687-4696, 2009.
5.
T.-S. Kim, K. Mackie, Q. Zhong, M. Peterson, T. Konno, and R. H. Dauskardt*, "Surfactant Mobility in Nanoporous Glass," Nano Letters, 9(6), 2427-2432, 2009.
4.
T.-S. Kim, N. Tsuji, K. Matsushita, N. Kobayashi, D. Chumakov, H. Geisler, E. Zschech, and R. H. Dauskardt*, "Tuning depth profiles of organosilicate films with ultraviolet curing," Journal of Applied Physics, 104, 074113, 2008.
3.
T.-S. Kim, N. Tsuji, N. Kemeling, K. Matsushita, D. Chumakov, H. Geisler, E. Zschech, and R. H. Dauskardt*, "Depth dependence of ultraviolet curing of organosilicate low-k thin films," Journal of Applied Physics, 103, 064108, 2008.
2.
D. Han, H. Park, Y. Park, T.-S. Kim, W. Yoon, J. Kim, and J. Park*, "Beneficial Effects of Freezing Rate Determined by Indirect Thermophysical Calculation on Cell Viability in Cryopreserved Tissues," Artificial Cells, Blood Substitutes, and Biotechnology, 34(2), 205-221, 2006.
1.
H. Park, Y. Park*, W. Yoon, T.-S. Kim, C. Yoon, S. Kim, S. Lim, J. Kim, Y. Kwak, D. Han, J. Park, and B. Cho, "Ideal Freezing Curve Can Avoid the Damage by Latent Heat of Fusion During Freezing," Korean J. Thorac. Cardiovasc. Surg., 36(4), 219-228, 2003.