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108.
Y.-H. Ko, K. Son, G. Kim, Y.-B. Park, D.-Y. Yu, J. Bang, T.-S. Kim, "Effect of Graphene Oxide on the Electromigration Lifetime of Lead-free Solder Joints", Journal of Materials Science: Materials in Electronics, https://doi.org/10.1007/s10854-018-0506-y (Accepted)
107.
C. Kim, C. Oh, Y. Choi, K.-O. Jang, and T.-S. Kim*, "Improvement in Thermomechanical Reliability of Power Conversion Modules Using SiC Power Semiconductors: A Comparison of SiC and Si via FEM Simulation", Journal of the Microelectronics and Packaging Society, 25(3), 21-30, 2018
106.
H. E. Lee, D. Lee, T.-I. Lee, J. H. Shin, G.-M. Choi, C. Kim, S. H. Lee, J. H. Lee, Y. H. Kim, S.-M. Kang, S. H. Park, I.-S. Kang, T.-S. Kim, B.-S. Bae*, and K. J. Lee*, "Wireless Powered Wearable Micro Light-Emitting Diodes", Nano Energy, 55, 454-462, 2018.
105.
H. Lee, W.I. Kim, W. Youn, T. Park, S. Lee, T.-S. Kim, J. F. Mano, and I. S. Choi*, "Iron Gall Ink Revisited: In Situ Oxidation of Fe (II)–Tannin Complex for Fluidic‐Interface Engineering", Advanced Materials, 180509, 2018.
104.
I.-J. Park, T.I. Kim, S. Kang, G.W. Shim. Y. Woo, T.-S. Kim, and S.-Y. Choi*, "Stretchable thin-film transistors with molybdenum disulfide channels and graphene electrodes", Nanoscale, 10(34), 16069-16078, 2018
103.
J.H. Park, J. Seo, C. Kim, D. Joe, H.E. Lee, T.H. Im, J.Y. Seok, C.K. Jeong, B.S. Ma,. H.K. Park, T.-S. Kim, and K.J. Lee*, " Flash-Induced Stretchable Cu Conductor via Multiscale-Interfacial Couplings", Advanced Science, 1801146, 2018.
102.
G. Kim, J. Lee, S.-h. Park, S. Kang, T.-S. Kim, and Y.-B. Park*, " Comparison of Quantitative Interfacial Adhesion Energy Measurement Method between Copper RDL and WPR Dielectric Interface for FOWLP Applications", Journal of the Microelectronics and Packaging Society, 25(2), 41-48, 2018.
101.
S. Kang, J.-B. Pyo, and T.-S. Kim*, " Layer-by-Layer Assembly of Free-Standing Nanofilms by Controlled Rolling", Langmuir, 34(20), 5831-5836, 2018.
100.
S.Y. Son, J.-H. Kim, E. Song, K. Choi, J. Lee, K. Cho*, T.-S. Kim*, and T. Park*, " Exploiting π−π Stacking for Stretchable Semiconducting Polymers", Macromolecules, 51(7), 2572–2579, 2018.
99.
J. Seo, C. Kim, B.S. Ma, T.-I. Lee, J. H. Bong, J.-G. Oh, B. J. Cho and T.-S. Kim*, "Direct graphene transfer and its application to transfer printing using mechanically controlled, large area graphene/copper freestanding layer”, Advanced Functional Materials, 1707102, 2018.
98.
W. Kim, J. Choi, J.-H. Kim, T. Kim, C. Lee, S. Lee, M. Kim, B. J. Kim*, and T.-S. Kim*, "Comparative Study of the Mechanical Properties of All-Polymer and Fullerene-Polymer Solar Cells: The Importance of Polymer Acceptors for High Fracture Resistance", Chemistry of Materials, 30(6), 2102-2111, 2018.
97.
S. Kang, J. Kim, J.-B. Pyo, J. H. Cho, and T.-S. Kim*,“Design of Magnetic Force Field for Trajectory Control of Levitated Diamagnetic Graphite”, International Journal of Precision Engineering and Manufacturing-Green Technology, 5, 341-347, 2018.
96.
W. Lee, J.-H. Kim, T. Kim, S. Kim, C. Lee, J.-S. Kim, H. Ahn, T.-S. Kim, B. J. Kim*, "Mechanically Robust and High-Performance Solar Cells Combining the Merits of All-Polymer and Fullerene Blends”, Journal of Materials Chemistry A, 6, 4494-4503, 2018.
95.
Y. Kim, Y. Kim, T.-I. Lee, T.-S. Kim, S. Ryu*, “An Extended Analytic Model for the Elastic Properties of Platelet-Staggered Composites and Its Application to 3D Printed Structures”, Composite Structures, 189, 27-36, 2018.
94.
I.-J. Park, T. I. Kim, T. Yoon, S. Kang, H. Cho, N. S. Cho, J.-I. Lee, T.-S. Kim, and S.-Y. Choi*,“Flexible and Transparent Graphene Electrode Architecture with Selective Defect Decoration for Organic Light-Emitting Diodes”, Advanced Functional Materials, 28, 1704435, 2018.
93.
J.-W. Shin, J.-H. Han, H. Cho, J. Moon, B.-H. Kwon, S. Cho, T. Yoon, T.-S. Kim, M. Suemitsu, J.-I. Lee, and N. S. Cho*, “Display process compatible accurate graphene patterning for OLED applications”, 2D Materials, 5, 014003, 2018.
92.
S. Jang, C. Kim, J. J. Park, M. L. Jin, S. J. Kim, O. O. Park, T.-S. Kim and H.-T Jung*, “A High Aspect Ratio Serpentine Structure for Use As a Strain-Insensitive, Stretchable Transparent Conductor”, Small, 1702818, 2018.
91.
H. J. Han, J. W. Jeong, S. R. Yang, C. Kim, H. G. Yoo, J.-B. Yoon, J. H. Park, K. J. Lee, T.-S. Kim, S.-W. Kim, and Y.S. Jung*, “Nanotransplantation Printing of Crystallographic-Orientation-Controlled Single-Crystalline Nanowire Arrays on Diverse Surfaces”, ACS Nano, 11, 11642-11652, 2017.
90.
Y. S. Oh, H. Choi, J. Lee, H. Lee, D. Y. Choi, S.-U. Lee, K.-S. Yun, S. Yoo, T.-S. Kim, I. Park*, and H. J. Sung*, “Temperature-Controlled Direct Imprinting of Ag Ionic Ink: Flexible Metal Grid Transparent Conductors with Enhanced Electromechanical Durability”, Scientific Reports, 7, 11220, 2017.
89.
I. Lee, J. Noh, J.-Y. Lee*, and T.-S. Kim*, “Co-optimization of Adhesion and Power Conversion Efficiency of Organic Solar Cells by Controlling Surface Energy of Buffer Layers”, ACS Applied Materials & Interfaces, 9, 37395-37401, 2017.
88.
S.-Y. Kim, J.H. Bong, C. Kim, W.S. Hwang, T.-S. Kim, B.J. Cho*, “Mechanical Stability Analysis via Neutral Mechanical Plane for High-Performance Flexible Si Nanomembrane FDSOI Device”, Advanced Materials Interfaces , 4, 1700618, 2017.
87.
J.-H. Kim, T.-I. Lee, T.-S. Kim, K.-W. Paik*, “The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications”, IEEE Trans. Compon., Packag., Manuf. Technol., 7(10), 1583-1591, 2017.
86.
W. Jo, J. Seo, and T.-S. Kim*, “Manufacturing of Metal Micro-wire Interconnection on Submillimeter Diameter Catheter”, Journal of the Microelectronics and Packaging Society, 24(2), 29-35, 2017.
85.
T.-I. Lee, C. Kim, J.-B. Pyo, M.S. Kim*, and T.-S. Kim*, “Effect of Anisotropic Thermo-Elastic Properties of Woven-Fabric Laminates on Diagonal Warpage of Thin Package Substrates”, Composite Structures, 176, 973-981, 2017.
84.
C. Kim, T.-I. Lee, M.S. Kim*, and T.-S. Kim*, “Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing”, Microelectronics Reliability, 73, 136-145, 2017.
83.
T. Yoon, T.-S. Kim*, “Thermo-Mechanical Reliability of TSV based 3D-IC”, Journal of the Microelectronics and Packaging Society, 24(1), 35-43, 2017.
82.
J. Park, S. Han, D. Kim, B. You, S. Hong, J. Seo, J. Kwon, C. Jeong, H. Park, T.-S. Kim, S. Ko*, K. Lee*, “Plasmonic-Tuned Flash Cu Nanowelding for Ultrafast Photochemical-Reducing and Interlocking on Flexible Plastics”, Advanced Functional Materials, 1701138, 2017.
81.
W. Kim, I. Lee, D.-Y. Kim, Y.-Y. Yu, H.-Y. Jung, S. Kwon, W.-S. Park, T.-S. Kim*, “Controlled multiple neutral planes by low elastic modulus adhesive for flexible organic photovoltaics”, Nanotechnology, 28, 194002, 2017.
80.
J.-H. Kim, J. Noh, H. Choi, J.-Y. Lee*, T.-S. Kim*, “Mechanical Properties of Polymer-Fullerene Bulk Heterojunction Films: Role of Nanomorphology of Composite Films”, Chemistry of Materials, 29(9), 3954-3961, 2017.
79.
H. J. Kim, M. Y. Lee, J.-S. Kim, J.-S. Kim, J.-H. Kim, H. Yu, H. Yun, K. Liao, T.-S. Kim*, J. H. Oh*, B. J. Kim*, “Solution-Assembled Blends of Regioregularity Controlled Polythiophenes for Coexistence of Mechanical Resilience and Electronic Performance”, ACS Applied Materials & Interfaces, 9(16), 14120-14128, 2017.
78.
J. Kim, C. Kim, Y. Song, S.-G. Jeong, T.-S. Kim*, C.-S. Lee*, “Reversible Self-Bending Soft Hydrogel Microstructures with Mechanically Optimized Designs”, Chemical Engineering Journal, 321, 384-393, 2017.
77.
Y. Kim, T. Yoon, T.-W. Kim, T.-S. Kim, K.-W. Paik*, “Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn-Ag Microbump”, IEEE Trans. Compon., Packag., Manuf. Technol., 7(3), 371-378, 2017.
76.
K.-L. Jang, S. Kim, B.-H. Jeong, J.-G. Oh, B. K. Hong*, T.-S. Kim*, “Electromechanical diagnostic method for monitoring cracks in polymer electrolyte fuel cell electrodes”, International Journal of Hydrogen Energy, 42(16), 11644-11653, 2017.
75.
D. Rodriquez, J.-H. Kim, S. E. Root, Z. Pei, P. Boufflet, M. Heeney, T.-S. Kim*, D. J. Lipomi*, “Comparison of Methods for Determining the Mechanical Properties of Semiconducting Polymer Films for Stretchable Electronics”, ACS Applied Materials & Interfaces, 9(10), 8855-8862, 2017.
74.
I. Lee, J. H. Yun, H. J. Son, T.-S. Kim*, “Accelerated Degradation Due to Weakened Adhesion from Li-TFSI Additives in Perovskite Solar Cells”, ACS Applied Materials & Interfaces, 9(8), 7029-7035, 2017.
73.
J.-H. Kim, I. Lee, T.-S. Kim*, N. Rolston, B. L. Watson, and R. H. Dauskardt*, “Understanding mechanical behavior and reliability of organic electronic materials”, MRS Bulletin, 42(2), 115-123, 2017.
72.
M. Yang, Y.-H. Ko, J. Bang, T.-S. Kim, C.-W. Lee*, S. Zhang, M. Li*, “Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates”, Journal of Alloys and Compounds, 701, 533-541, 2017.
71.
M. Yang, Y.-H. Ko, J. Bang, T.-S. Kim, C.-W. Lee*, M. Li*, “Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate”, Materials Characterization, 124, 250-259, 2017.
70.
J.H. Bong, C. Kim, W.S. Hwang, T.-S. Kim*, and B.J. Cho*, “A Quantitative Strain Analysis of a Flexible Single-Crystalline Silicon Membrane”, Applied Physics Letters, 110(3), 033105, 2017.
69.
J.-W. Seo, M. Joo, J. Ahn, T.-I. Lee, T.-S. Kim, S. G. Im*, and J.-Y. Lee*, “Facilitated Embedding of Silver Nanowires into Conformally-Coated iCVD Polymer Films Deposited on Cloths for Robust Wearable Electronics”, Nanoscale, 9(10), 3399-3407, 2017.
68.
J. H. Park, G.-T. Hwang, S. Kim, J. Seo, H.-J. Park, K. Yu, T.-S. Kim, and K.-J. Lee*, “Flash-Induced Self-Limited Plasmonic Welding of Silver Nanowire Network for Transparent Flexible Energy Harvester”, Advanced Materials, 29(5), 1603473, 2017.
67.
T.-I. Lee, C. Kim, M.S. Kim*, and T.-S. Kim*, “Measurement of Flexural Modulus of Lamination Layers on Flexible Substrates ”, Journal of the Microelectronics & Packaging Society, 23(3), 63-67, 2016.
66.
T.-W. Kim, T.-I. Lee, Y. Pan, W. Kim, S. Zhang, T.-S. Kim, and K.-W. Paik*, “Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly”, IEEE Trans. Compon., Packag., Manuf. Technol., 6(9), 1317-1329, 2016.
65.
C. Kim, T.-I. Lee, and T.-S. Kim*, “Measurement Technologies of Mechanical Properties of Polymers used for Flexible and Stretchable Electronic Packaging”, Journal of the Microelectronics & Packaging Society, 23(2), 19-28, 2016.
64.
Y.-H. Ko, K. Choi, S. W. Kim, D.-Y. Yu, J. Bang, and T.-S. Kim*, “Trends of Researches and Technologies of Electronic Packaging Using Graphene”, Journal of the Microelectronics & Packaging Society, 23(2), 1-10, 2016.
63.
J. Ahn, J.-W. Seo, T.-I. Lee, D. Kwon, I. Park, T.-S. Kim, and J.-Y. Lee*, “Extremely Robust and Patternable Electrodes for Copy-Paper-Based Electronics”, ACS Applied Materials & Interfaces, 19031-19037, 2016.
62.
S. Jang, W. -B. Jung, C. Kim, P. Won, S.-G. Lee, K. M. Cho, M. L. Jin, C. J. An, H.-J. Jeon, S. H. Ko, T.-S. Kim, and H.-T. Jung*, “A three-dimensional metal grid mesh as a practical alternative to ITO”, Nanoscale, 14257-14263, 2016.
61.
D. Kwon, T.-I. Lee, J. Shim, S. Ryu, M. S. Kim, S. Kim, T.-S. Kim, I. Park*, “Highly Sensitive, Flexible and Wearable Pressure Sensor Based on a Giant Piezocapacitive Effect of Three-Dimensional Microporous Elastomeric Dielectric Layer”, ACS Applied Materials & Interfaces, 16922-16931, 2016.
60.
J. Lee, T.-H. Han, M.-H. Park, Y. Jung, J. Seo, H.-K. Seo, H. Cho, E. Kim, J. Chung, S.-Y. Choi, T.-S. Kim, T.-W. Lee*, and S. Yoo*, “Synergetic electrode architecture for efficient graphene-based flexible organic light-emitting diodes”, Nature Communications, 7, 11791, 2016.
59.
T.-I. Lee, C. Kim, M.S. Kim*, and T.-S. Kim*, “Flexural and Tensile Moduli of Flexible FR4 Substrates”, Polymer Testing, 53, 70-76, 2016.
58.
S. Kim, J.-H. Kim, J.-G. Oh, K.-L. Jang, B.-H. Jeong, B.K. Hong*, and T.-S. Kim*, “Mechanical Behavior of Free-Standing Fuel Cell Electrodes on Water Surface”, ACS Applied Materials & Interfaces, 15391-15398, 2016.
57.
J.-B. Pyo, T.-I. Lee, C. Kim, M.S. Kim*, and T.-S. Kim*, “Prediction of time-dependent swelling of flexible polymer substrates using hygro-mechanical finite element simulations”, Soft Matter, 12, 4135-4141, 2016.
56.
M.S. Oh, Y.S. Song, C. Kim, J. Kim, J.B. You, T.-S. Kim, C.-S Lee*, and S.G. Im*, “Control of Reversible Self-Bending Behavior in Responsive Janus Microstrips”, ACS Applied Materials & Interfaces, 8782-8788, 2016.
55.
T.-I. Lee, M.S. Kim*, and T.-S. Kim*, “Contact-Free Thermal Expansion Measurement of Very Soft Elastomers using Digital Image Correlation”, Polymer Testing, 51, 181-189, 2016.
54.
Y.-H. Ko, J.-D. Lee, T. Yoon, C.-W. Lee, and T.-S. Kim*, “Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene”, ACS Applied Materials & Interfaces, 8 (8), 5679–5686, 2016.
53.
J.-H. Kim, T.-I. Lee, J.-W. Shin, T.-S. Kim, and K.-W. Paik*, “Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications”, IEEE Trans. Compon., Packag., Manuf. Technol., 6(2), 208-215, 2016.
52.
Y.-L. Kim, T.-I. Lee, J.-H. Kim, W. Kim, T.-S. Kim, and K.-W. Paik*, “Effects of the Mechanical Properties of Polymer Resin and the Conductive Ball Types of Anisotropic Conductive Films on the Bending Properties of Chip-in-Flex Package”, IEEE Trans. Compon., Packag., Manuf. Technol., 6(2), 200-207, 2016.
51.
T. Yoon, J.-H. Kim, J.H. Choi, D.Y. Jung, I.-J. Park, S.-Y. Choi, N.S. Cho, J.-I. Lee, Y.-D. Kwon, S. Cho, and T.-S. Kim*, “Healing Graphene Defects using Selective Electrochemical Deposition: Toward Flexible and Stretchable Devices,” ACS Nano, 10, 1539-1545, 2016.
50.
I. Lee, G. W. Kim, M. Yang, and T.-S. Kim*, “Simultaneously Enhancing the Cohesion and Electrical Conductivity of PEDOT:PSS Conductive Polymer Films using DMSO Additives,” ACS Applied Materials & Interfaces, 8(1), 302-310, 2016.
49.
S.-H. Kim, H. R. Lee, S. J. Yu, M.-E. Han, D. Y. Lee, S. Y. Kim, H.-J. Ahn, M.-J. Han, T.-I. Lee, T.-S. Kim, S. K. Kwon*, S.-G. Im*, N. S. Hwang*, “Hydrogel-laden paper scaffold system for origami-based tissue engineering,” Proc. Natl. Acad. Sci., 1504745112, 2015.
48.
H. Eom, J.-H. Kim, J. Hur, T.-S. Kim, S.-K. Sung, J.-H. Choi, E. Lee, J.-H. Jeong*, and I. Park*, “Nanotextured Polymer Substrate for Flexible and Mechanically Robust Metal Electrodes by Nanoimprint Lithography”, ACS Applied Materials & Interfaces, 7, 25171-25179, 2015.
47.
Y.-H. Lee, Y. Kim, T.-I. Lee, I. Lee, J. Shin, H. S. Lee, T.-S. Kim, and J. W. Choi*, “Anomalous Stretchable Conductivity Using an Engineered Tricot Weave”, ACS Nano, 9 (12), 12214–12223, 2015.
46.
T. Kim, J.-H. Kim, T. E. Kang, C. Lee, H. Kang, M. Shin, C. Wang, B. Ma, U. Jeong, T.-S. Kim*, and B. J. Kim*, "Flexible, Highly Efficient All-Polymer Solar Cells", Nature Communications, 6, 8547, 2015.
45.
J. H. Yun, I. Lee, T.-S. Kim, M. J. Ko, J. Y. Kim, and H. J. Son*, “Synergistic enhancement and mechanism study of mechanical and moisture stability of perovskite solar cells introducing polyethylene-imine into the CH3NH3PbI3/HTM interface,” Journal of Materials Chemistry A, 3, 22176, 2015.
44.
J.-H. Kim, K.-S. Kim, K.-R. Jang, S.-B. Jung*, and T.-S. Kim*, “Enhancing Adhesion of Screen-Printed Silver Nanopaste Films,” Advanced Materials Interfaces, 2, 1500283, 2015.
43.
J.-S. Kim, J.-H. Kim, W. Lee, H. Yu, H. J. Kim, I. Song, M. Shin, J. H. Oh, U. Jeong, T.-S. Kim*, and B. Kim*, “Tuning Mechanical and Opto-Electrical Properties of Poly(3-hexylthiophene) through Systematic Regioregularity Control,” Macromolecules, 48, 4339-4346, 2015.
42.
C. Kim, T.-I. Lee, M.S. Kim*, and T.-S. Kim*, “Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates,” Polymers, 7(6), 985-1004, 2015.
41.
Y.-H. Ko, M.-S. Kim, J. Bang, T.-S. Kim, and C.-W. Lee*, “Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate,” Journal of Electronic Materials, 44 (7), 2458-2466, 2015.
40.
C.-C. Yu, S. Kim, J. D. Baek, Y. Li, P.-C. Su*, and T.-S. Kim*, “Direct Observation of Nanoscale Pt Electrode Agglomeration at the Triple Phase Boundary,” ACS Applied Materials & Interfaces, 7(11), 6036-6040, 2015.
39.
Y. K. Jeong, T.-w. Kwon, I. Lee, T.-S. Kim, A. Coskun*, and J. W. Choi*, “Millipede-inspired Structural Design Principles for High Performance Polysaccharide Binders in Silicon Anodes,” Energy and Environmental Science, 8, 1224-1230, 2015.
38.
D. J. Kang, H.-H. Cho, I. Lee, K.-H. Kim, H. J. Kim, K. Liao, T.-S. Kim, and B. J. Kim*, “Enhancing Mechanical Properties of Highly Efficient Polymer Solar Cells Using Size-Tuned Polymer Nanoparticles,” ACS Applied Materials & Interfaces, 7, 2668-2676, 2015.
37.
J. Seo, W. S. Chang, and T.-S. Kim*, “Adhesion Improvement of Graphene/Copper Interface using UV/Ozone Treatments,” Thin Solid Films, 584, 170-175, 2015.
36.
T.-w. Kwon, Y. K. Jeong, I. Lee, T.-S. Kim, J. W. Choi*, and A. Coskun*, “Systematic Molecular-Level Design of Binders Incorporating Meldrum`s Acid for Silicon Anodes in Lithium Rechargeable Batteries,” Advanced Materials, 26, 7979-7985, 2014.
35.
H. J. Kim, J.-H. Kim, J.-H. Ryu, Y. Kim, H. Kang, W. B. Lee, T.-S. Kim*, and B. J. Kim*, “Architectural Engineering of Rod-Coil Compatibilizers for Producing Mechanically and Thermally Stable Polymer Solar Cells,” ACS Nano, 8(10), 10461-10470, 2014.
34.
S. Kim, B.-H. Jeong, B. K. Hong*, and T.-S. Kim*, “Effects of hydrophobic agent content in macro-porous substrates on the fracture behavior of the gas diffusion layer for proton exchange membrane fuel cells,Journal of Power Sources, 270, 342-348, 2014.
33.
T. Yoon, W. S. Jo, and T.-S. Kim*, “High-Yield Etching-Free Transfer of Graphene: A Fracture Mechanics Approach,” Journal of the Microelectronics & Packaging Society, 21(2), 59-64, 2014.
32.
I. Lee and T.-S. Kim*, “Thermal Assisted UV-Ozone Treatment to Improve Reliability of Ag Nanoparticle Thin Films,” Journal of the Microelectronics & Packaging Society, 21(1), 41-44, 2014.
31.
J.-S. Kim, Y.-H. Lee, I. Lee, T.-S. Kim, M.-H. Ryou*, and J. W. Choi*, “Large Area Multi-stacked Lithium-ion Batteries for Flexible and Rollable Applications,” Journal of Materials Chemistry A, 2, 10862-10868, 2014.
30.
S. Kim and T.-S. Kim*, “Adhesion improvement of silicon/underfill/polyimide interfaces by UV/ozone treatment and sol-gel derived hybrid layers,” Microelectronics Reliability, 54, 833-839, 2014.
29.
Y. K. Jeong, T.-w. Kwon, I. Lee, T.-S. Kim, A. Coskun*, and J. W. Choi*, “Hyperbranched β-Cyclodextrin Polymer as an Effective Multidimensional Binder for Silicon Anodes in Lithium Rechargeable Batteries,” Nano Letters, 14, 864-870, 2014.
28.
W. Jung, T. Yoon, J. Choi, S. Kim, Y. Kim*, T.-S. Kim* and C. Han*, “Superstrong encapsulated monolayer graphene by the modified anodic bonding,” Nanoscale, 6, 547-554, 2014.
27.
T. Yoon, J. Moon, B. Cho*, and T.-S. Kim*, “Penetration and Lateral Diffusion Characteristics of Polycrystalline Graphene Barriers,” Nanoscale, 6, 151-156, 2014. (selected for "This week's HOT articles")
26.
W. Jung, J. Park, T. Yoon, T.-S. Kim, S. Kim* and C. Han*, “Prevention of water permeation by strong adhesion between graphene and SiO2 substrate,” Small, 10(9), 1704-1711, 2014.

25.

Y. Lee, J. Kim, J. Noh, I. Lee, H. Kim, S. Choi, J. Seo, M. Kim, S. Jeon, T.-S. Kim*, J. Lee*, and J. Choi*, “Wearable textile battery rechargeable by solar energy,” Nano Letters, 13(11), 5753-5761, 2013.

-The Most Read Article in Nano Letters in November 2013
-Featured in Nature [Link
-Selected as one of top 10 power management news in EE times Europe [Link]

24.
W.C. Shin, T. Yoon, J.H. Mun, T.Y. Kim, S.Y. Choi, T.-S. Kim* and B.J. Cho*, “Doping suppression and mobility enhancement of graphene transistors fabricated using an adhesion promoting dry transfer process,” Applied Physics Letters, 103, 243504, 2013.
23.
C. Lee, J.-H. Kim, C. Zou, I. Cho, J. Weisse, W. Nemeth, Q. Wang, A. van Duin, T.-S. Kim*, and X. Zheng* “Peel-and-Stick: Mechanism Study for Efficient Fabrication of Flexible/Transparent Thin-film Electronics,” Scientific Reports, 3, 2917, 2013.
22.
J.-H. Kim, A. Nizami, Y. Hwangbo, B. Jang, H. Lee, C. Woo, S. Hyun*, and T.-S. Kim*, “Tensile Testing of Ultra-Thin Films on Water Surface,” Nature Communications, 4, 2520, 2013.
21.
I. Lee, J. Lee, S. Ko*, and T.-S. Kim*, “Reinforcing Ag Nanoparticle Thin Films by Very Long Ag Nanowires,” Nanotechnology, 24, 415704, 2013.
20.
J. Hwang, T. Yoon, S. Jin, J. Lee, T.-S. Kim, S. Hong*, and S. Jeon*, “Enhanced Mechanical Properties of Graphene/Copper Nanocomposites Using a Molecular-Level Mixing Process,” Advanced Materials, 25, 6724-6729, 2013. (Received the 2014 KINC Fusion Research Award)
19.
J. Lee, P. Lee, H. Lee, S. Hong, I. Lee, J. Yeo, S. Lee, T.-S. Kim, D. Lee*, and S. Ko*, "Room-Temperature Nanosoldering of a Very Long Metal Nanowire Network by Conducting-Polymer-Assisted Joining for a Flexible Touch-Panel Application," Advanced Functional Materials, 23(34), 4171-7176,2013. (front cover)
18.
J. Lee, I. Lee, T.-S. Kim, and J.-Y. Lee*, "Efficient Welding of Silver Nanowire Networks without Post-Processing," Small, 9(17), 2887-2894, 2013.

17.
Y. Ko, M. Kim, T.-S. Kim, J. Bang, and C. Lee*, “Study on Joint of Micro Solder Bump for Application of Flexible Electronics,” Journal of the Korean Welding and Joining Society, 31(3), 4-10, 2013.
16.
C. Kim, H. Choi, M. Kim, and T.-S. Kim*, “Packaging Substrate Bending Prediction due to Residual Stress,” Journal of the Microelectronics and Packaging Society, 20(1), 21-26, 2013.
15.
M.-H. Ryou, J. Kim, I. Lee, S. Kim, Y. K. Jeong, S. Hong, J. H. Ryu, T.-S. Kim, J.-K. Park*, H. Lee*, J. W. Choi*, "Mussel-Inspired Adhesive Binders for High-Performance Silicon Nanoparticle Anodes in Lithium-Ion Batteries ," Advanced Materials, 25(11), 1571-1576, 2013. (frontpiece article)
14.
S. Kim and T.-S. Kim*, “Adhesion Reliability Enhancement of Silicon/Epoxy/Polyimide Interfaces for Flexible Electronics,” Journal of the Microelectronics and Packaging Society, 19(3), 63-69, 2012.
13.
Y. Ko, T.-S. Kim, Y. Lee, S. Yoo, and C. Lee*, “Reliability of High Temperature and Vibration in Sn3.5Ag and Sn0.7Cu Lead-free Solders," Journal of the Microelectronics and Packaging Society, 19(3), 31-36, 2012.
12.
I. Lee, S. Kim, J. Yun, I. Park*, and T.-S. Kim*, “Interfacial toughening of solution processed Ag nanoparticle thin films by organic residuals,”Nanotechnology, 23, 485704, 2012.
11.
T.-S. Kim*, “Adhesion Measurement Methods for Thin Films in Microelectronics,” Journal of the Korean Welding and Joining Society, 30(3), 213-218, 2012.
10.
T. Yoon, W. C. Shin, T. Y. Kim, J. H. Mun, T.-S. Kim*, and B. J. Cho*, "Direct Measurement of Adhesion Energy of Monolayer Graphene As-Grown on Copper and Its Application to Renewable Transfer Process," Nano Letters, 12(3), 1448-1452, 2012. (Supporting Information)
9.
T.-S. Kim and R. H. Dauskardt, "Molecular Mobility under Nanometer Scale Confinement," Nano Letters, 10(5), 1955-1959, 2010.
  Before 2010
8.
T.-S. Kim and R. H. Dauskardt*, "Integration Challenges of Nanoporous Low Dielectric Constant Materials," IEEE Transactions on Device and Materials Reliability, 9(4), 509-515, 2009.
7.
T.-S. Kim, D. Chumakov, E. Zschech, and R. H. Dauskardt*, "Tailoring UV cure depth profiles for optimal mechanical properties of organosilicate thin films," Applied Physics Letters, 95, 071902, 2009.
6.
T.-S. Kim, T. Konno, and R. H. Dauskardt*, "Surfactant-Controlled Damage Evolution during Chemical Mechanical Planarization of Nanoporous Films," Acta Materialia, 57, 4687-4696, 2009.
5.
T.-S. Kim, K. Mackie, Q. Zhong, M. Peterson, T. Konno, and R. H. Dauskardt*, "Surfactant Mobility in Nanoporous Glass," Nano Letters, 9(6), 2427-2432, 2009.
4.
T.-S. Kim, N. Tsuji, K. Matsushita, N. Kobayashi, D. Chumakov, H. Geisler, E. Zschech, and R. H. Dauskardt*, "Tuning depth profiles of organosilicate films with ultraviolet curing," Journal of Applied Physics, 104, 074113, 2008.
3.
T.-S. Kim, N. Tsuji, N. Kemeling, K. Matsushita, D. Chumakov, H. Geisler, E. Zschech, and R. H. Dauskardt*, "Depth dependence of ultraviolet curing of organosilicate low-k thin films," Journal of Applied Physics, 103, 064108, 2008.
2.
D. Han, H. Park, Y. Park, T.-S. Kim, W. Yoon, J. Kim, and J. Park*, "Beneficial Effects of Freezing Rate Determined by Indirect Thermophysical Calculation on Cell Viability in Cryopreserved Tissues," Artificial Cells, Blood Substitutes, and Biotechnology, 34(2), 205-221, 2006.
1.
H. Park, Y. Park*, W. Yoon, T.-S. Kim, C. Yoon, S. Kim, S. Lim, J. Kim, Y. Kwak, D. Han, J. Park, and B. Cho, "Ideal Freezing Curve Can Avoid the Damage by Latent Heat of Fusion During Freezing," Korean J. Thorac. Cardiovasc. Surg., 36(4), 219-228, 2003.