J.-B. Pyo+, J. H. Kim+, and T.-S. Kim*, "Highly Robust Nanostructured Carbon Films by Thermal Reconfiguration of Ionomer Binding", Journal of Materials Chemistry A, 8, 24763, 2020.

S. Choi, W. Jo, Y. Jeon, S. Kwon, J. H. Kwon, Y. H. Son, J. Kim, J. H. Park, H. Kim, H. S. Lee, M. Nam, E. G. Jeong, J. B. Shin, T.-S. Kim, and K. C. Choi*, "Multi-directionally wrinkle-able textile OLEDs for clothing-type displays ", NPJ Flexible Electronics, 4(1), 1-9, 2020.

J. Koo+, S. Lee+, J. Kim, D. H. Kim, B. -H. Choi, T.-S. Kim*, and J. H. Shim* "Evaluating Mechanical Properties of 100nm-Thick Atomic Layer Deposited Al2O3 as a Free-Standing Film", Scripta Materialia, 187, 256-261, 2020.

S. Jeon+, I. Lee+, T.-S. Kim* and J.-Y. Lee*, "An Interlocking Fibrillar Polymer Layer for Mechanical Stability of Perovskite Solar Cells", Advanced Materials Interfaces, 2001425, 2020.

J. Chung, S. S. Shin, K. Hwang, G. Kim, K. W. Kim, D. S. Lee, W. Kim, B. S. Ma, Y.-K. Kim, T.-S. Kim, and J. Seo*, "Record-efficiency flexible perovskite solar cell and module enabled by a porous-planar structure as an electron transport layer", Energy & Environment Science, 13, 4854-4861, 2020.

H.G. Seo, S. Ji, J. Seo, S. Kim, B. Koo, Y. Choi, H. Kim, J.H. Kim, T.-S. Kim, and W. Jung* "Sintering-resistant platinum electrode achieved through atomic layer deposition for thin-film solid oxide fuel cells", Jounal of Alloys and Compounds, 835, 155347, 2020

Y. Han, H. J. Han, Y. Rah, C. Kim, M. Kim, H. Lim, K. H. Ahn, H. Jang, K. Yu, T.-S. Kim, E. N. Cho*, and Y. S. Jung*, "Desolvation‐Triggered Versatile Transfer‐Printing of Pure BN Films with Thermal–Optical Dual Functionality", Advanced Materials, 2002099, 2020.

J. H. Kim, J.-B. Pyo and T.-S. Kim*, "Highly Mobile Levitating Soft Actuator Driven by Multistimuli-Responses", Advanced Materials Interfaces, 2001051, 2020.

S. Kang and T.-S. Kim*, "Nanofilm Transfer Methods and Interfacial Fracture Mechanics", Journal of the Microelectronics and Packaging Society, 27(3), 9-19, 2020.

J. Kim, C.-Y. Gu, and T.-S. Kim*, "Thermal Warpage Behavior of Single-Side Polished Wafers", Journal of the Microelectronics and Packaging Society, 27(3), 89-93, 2020.

S. J. Oh, B. S. Ma, H. J. Kim, C. Yang, and T.-S. Kim*, "Measurement of Mechanical Properties of Thin Film Materials for Flexible Displays", Journal of the Microelectronics and Packaging Society, 27(3), 77-81, 2020.

T. Kim, H. Lee, W. Jo, T.-S. Kim and S. Yoo*, "Realizing Stretchable OLEDs: A Hybrid Platform Based on Rigid Island Arrays on a Stress-Relieving Bilayer Structure", Advanced Materials Technologies, 2000494, 2020.

E. Kim, J. Kwon, C. Kim, T.-S. Kim, K.C. Choi, and S. Yoo*, "Design of ultrathin OLEDs having oxide-based transparent electrodes and encapsulation with sub-mm bending radius", Organic Electronics, 82, 105704, 2020.

G.-U. Kim, Y. W. Lee, B. S. Ma, J. Kim, J. S. Park, S. Lee, T. L. Nguyen, M. Song, T.-S. Kim, H. Y. Woo and B. J. Kim*, "Triad-type, multi-functional compatibilizers for enhancing efficiency, stability and mechanical robustness of polymer solar cells", Journal of Materials Chemistry A, 8, 13522, 2020.

Y. Pan, S. J. Oh, J.-H. Kim, T.-S. Kim, and K.-W. Paik*, "A Study on the Dynamic Bending Property of Chip-on-Flex (COF) Assembly using Anchoring Polymer Layer (APL) Anisotropic Conductive Films (ACFs)", IEEE Trans. Compon., Packag., Manuf. Technol., 10(6), 941-948, 2020

B. S. Ma, W. Jo, W. Kim and T.-S. Kim*, "Mechanical Modeling of Rollable OLED Display Apparatus Considering Spring Component", Journal of the Microelectronics and Packaging Society, 27(2), 19-26, 2020.

S.-H. Heo+, C. Kim+, T.-S. Kim*, and H.-S. Park* "Human-Palm-Inspired Artificial Skin Material Enhances Operational Functionality of Hand Manipulation", Advanced Functional Materials, 30, 2002360, 2020. (selected for Frontispiece)

H. Lee, M. Jeong, G. Kim, K. Son, J. Seo, T.-S. Kim, and Y.-B. Park* "Effects of Post-annealing and Co Interlayer Between SiNx and Cu on the Interfacial Adhesion Energy for Advanced Cu Interconnections", Electronic Materials Letters, 16, 311-320, 2020

S.-Y. Jung, T.-I. Lee, M. Cho, T.-S. Kim, and K.-W. Paik*, "A Study on the Flexible-Chip-On Fabric (COFa) Assemblies using Anisotropic Conductive Films (ACFs) and Metal-Laminated Fabric Substrates", IEEE Trans. Compon., Packag., Manuf. Technol., 10(3), 360-367, 2020.

Q. Fan, W. Su, S. Chen, W. Kim, X. Chen, B. Lee, T. Liu, UA. Méndez-Romero, R. Ma, T. Yang, W. Zhuang, Y. Li, Y. Li, T.-S. Kim*, L. Hou*, C. Yang*, H. Yan, D. Yu, and E. Wang* "Mechanically Robust All-Polymer Solar Cells from Narrow Band Gap Acceptors with Hetero-Bridging Atoms", Joule , 4(3), 658-672, 2020.

S. Lee, J.-H. Kim, Y.S. Kim*, T. Ohba, and T.-S. Kim*, "Effects of Thickness and Crystallographic Orientation on Tensile Properties of Thinned Silicon Wafers", IEEE Trans. Compon., Packag., Manuf. Technol., 10(2), 296-303, 2020. (2020 Best Paper Awards in Manufacturing category)

Y. Lim, S. Hong, K. L. Jang, H. Yang, S. Hwang, T.-S. Kim and Y.B. Kim*, "High-performance Ni/Pt Composite Catalytic Anode with Ultra-Low Pt Loading for Low-temperature Solid Oxide Fuel Cells", International Journal of Precision Engineering and Manufacturing-Green Technology, 7,141-150,2020

S.-Y. Jung, S. J. Oh, T.-I. Lee, T.-S. Kim and K.-W. Paik*, "A Study on the Fabric Substrates with Fine-pitch Laminated Cu Metal Patterns using B-stage Adhesive Films", IEEE Trans. Compon., Packag., Manuf. Technol., 10(1), 176-183, 2020.

J.-W. Lee+, B. S. Ma+, J. Choi, J. Lee, S. Lee, K. Liao, W. Lee*, T.-S. Kim* and B. J. Kim*, "Origin of the High Donor-Acceptor Composition Tolerance in Device Performance and Mechanical Robustness of All-Polymer Solar Cells", Chemistry of Materials, 32(1), 582-594, 2020.

S. Lee, Y. Kim, Z. Wu, C. Lee, S. J. Oh, N. T. Luan, J. Lee, D. Jeong, K. Zhang, F. Huang, T.-S. Kim, H. Y. Woo, and B. J. Kim*, "Aqueous-Soluble Naphthalene Diimide-Based Polymer Acceptors for Efficient and Air-Stable All-Polymer Solar Cells". ACS Applied Materials & Interfaces, 11, 45038-45047, 2019.

H. J. Kim, K. H. Ahn, S. J. Oh, D. H. Kim, J. S. Kim, E. S. Kim, and T.-S. Kim*, "Measurement of EMC/PCB Interfacial Adhesion Energy of Chip Package Considering Warpage", Journal of the Microelectronics and Packaging Society, 26(4), 101-105, 2019.

Y. Ko*, D.-Y. Yu, J. Son, J. H. Bang and T.-S. Kim*, "Improving Joint Reliability of Lead-free Solder on Flexible Substrate under Cyclic Bending by Adding Graphene Oxide Powder". Journal of the Microelectronics and Packaging Society, 26(3), 43-49, 2019.

J. Choi+, W. Kim+, S. Kim, T.-S. Kim* and B. J. Kim*, "Influence of Acceptor Type and Polymer Molecular Weight on the Mechanical Properties of Polymer Solar Cells", Chemistry of Materials, 31(21), 9057-9069, 2019.

H. Park, B. S. Ma, J.-S. Kim, Y. Kim, H. J. Kim, D. Kim, J. Han, F. S. Kim, T.-S. Kim and B. J. Kim*, "Regioregular-block-Regiorandom Poly(3-hexylthiophene) Copolymers for Mechanically-Robust and High-Performance Thin Film Transistors", Macromolecules, 52(20), 7721-7730, 2019.

J. Bae, B. S. Ma, G. Jeon, W. Jeong, C. H. Je, T.-S. Kim* and S.-H. K. Park*, "Effect of High Film Stress of Mo Source and Drain Electrodes on Electrical Characteristics of Al Doped InZnSnO TFTs", IEEE Electron Device Letters, 40(11), 1760-1763, 2019.

S. Kim, M. Amjadi, T.-I. Lee, Y. Jeong, D. Kwon, M. S. Kim, K. Kim, T.-S. Kim, Y. S. Oh*, and I. Park*, “Wearable, Ultrawide-Range, and Bending-Insensitive Pressure Sensor Based on Carbon Nanotube Network-Coated Porous Elastomer Sponges for Human Interface and Healthcare Devices”, ACS Applied Materials & Interfaces, 11, 23639-23648, 2019.

S. Kim, C. Kim, J. H. Bong, W. S. Hwang, T.-S. Kim, J. S. Oh, and B. J. Cho*, "Mechanical and Electrical Reliability Analysis of Flexible Si Complementary Metal-Oxide-Semiconductor Integrated Circuit", Journal of nanoscience and nanotechnology, 19(10), 6473-6480, 2019.

T. Yoon+, S. Kang+, T. Y. Kang, and T.-S. Kim*, "Detection of Graphene Cracks by Electromagnetic Induction, Insensitive to Doping Level", Computer Modeling in Engineering and Sciences, 120(2), 351-361, 2019.

J. Choi+, W. Kim+, D. Kim, S. Kim, J. Chae, S. Choi, S. F. Kim, T.-S. Kim*, and B. J. Kim*, “Importance of Critical Molecular Weight of Semicrystalline n-Type Polymers for Mechanically-Robust, Efficient Electroactive Thin Films”, Chemistry of Materials, 31 (9), 3163-3173, 2019.

J.-H. Kim+, K.-L. Jang+, K. Ahn, T. Yoon, T.-I. Lee, and T.-S. Kim*, "Thermal expansion behavior of thin films expanding freely on water surface", Scientific Reports, 9, 7071, 2019.

J. H. Kwon, Y. Jeon, D.-G. Kim, S. Lee, S. Lee, T.-S. Kim, and K. C. Choi*, " Low-Temperature and Corrosion-Resistant Gas Diffusion Multibarrier with UV and Heat Rejection Capability–A Strategy to Ensure Reliability of Organic Electronics", ACS applied materials & interfaces, 11, 16776−16784, 2019.

T.-I. Lee, W. Jo, W. Kim, J.-H. Kim, K.-W. Paik, and T.-S. Kim*, " Direct Visualization of Cross-Sectional Strain Distribution in Flexible Devices", ACS Applied Materials & Interfaces, 11 (14), 13416-13422, 2019.

S. Kang, T. Yoon, S. Kim, and T.-S. Kim*, " Role of Crack Deflection on Rate Dependent Mechanical Transfer of Multilayer Graphene and Its Application to Transparent Electrodes", ACS Applied Nano Materials, 2(4), 1980-1985, 2019.

H. Hwang, S. Park, J. H. Heo, W. Kim, H. Ahn, T.-S. Kim, S. H. Im, H. J. Son*. "Enhancing Performance and Stability of Perovskite Solar Cells using Hole Transport Layer of Small molecule and Conjugated Polymer Blend", Journal of Power Sources, 418, 167-175, 2019.

M. B. Khan, D. H. Kim, J. H. Han, H. Saif, H. Lee, Y. Lee, M. Kim, E. Jang, S. K. Hong, D. J. Joe, T.-I. Lee, T.-S. Kim, K. J. Lee*, Y. Lee*, "Performance Improvement of Flexible PiezoelectricEnergy Harvester for Irregular Human Motion withEnergy Extraction Enhancement Circuit", Nano Energy, 58, 211-219, 2019.

Y.-H. Ko*, K. Son, G. Kim, Y.-B. Park, D.-Y. Yu, J. Bang, T.-S. Kim*, "Effects of Graphene Oxide on the Electromigration Lifetime of Lead-free Solder Joints", Journal of Materials Science: Materials in Electronics, 30.3, 2334-2341, 2019.

C. Kim, C. Oh, Y. Choi, K.-O. Jang, and T.-S. Kim*, "Improvement in Thermomechanical Reliability of Power Conversion Modules Using SiC Power Semiconductors: A Comparison of SiC and Si via FEM Simulation", Journal of the Microelectronics and Packaging Society, 25(3), 21-30, 2018

H. E. Lee, D. Lee, T.-I. Lee, J. H. Shin, G.-M. Choi, C. Kim, S. H. Lee, J. H. Lee, Y. H. Kim, S.-M. Kang, S. H. Park, I.-S. Kang, T.-S. Kim, B.-S. Bae*, and K. J. Lee*, "Wireless Powered Wearable Micro Light-Emitting Diodes", Nano Energy, 55, 454-462, 2018.

H. Lee, W.I. Kim, W. Youn, T. Park, S. Lee, T.-S. Kim, J. F. Mano, and I. S. Choi*, "Iron Gall Ink Revisited: In Situ Oxidation of Fe (II)–Tannin Complex for Fluidic‐Interface Engineering", Advanced Materials, 180509, 2018.

I.-J. Park, T.I. Kim, S. Kang, G.W. Shim. Y. Woo, T.-S. Kim, and S.-Y. Choi*, "Stretchable thin-film transistors with molybdenum disulfide channels and graphene electrodes", Nanoscale, 10(34), 16069-16078, 2018

J.H. Park, J. Seo, C. Kim, D. Joe, H.E. Lee, T.H. Im, J.Y. Seok, C.K. Jeong, B. S. Ma,. H.K. Park, T.-S. Kim, and K.J. Lee*, " Flash-Induced Stretchable Cu Conductor via Multiscale-Interfacial Couplings", Advanced Science, 1801146, 2018.

G. Kim, J. Lee, S.-H. Park, S. Kang, T.-S. Kim, and Y.-B. Park*, " Comparison of Quantitative Interfacial Adhesion Energy Measurement Method between Copper RDL and WPR Dielectric Interface for FOWLP Applications", Journal of the Microelectronics and Packaging Society, 25(2), 41-48, 2018.

S. Kang, J.-B. Pyo, and T.-S. Kim*, " Layer-by-Layer Assembly of Free-Standing Nanofilms by Controlled Rolling", Langmuir, 34(20), 5831-5836, 2018.

S.Y. Son, J.-H. Kim, E. Song, K. Choi, J. Lee, K. Cho*, T.-S. Kim*, and T. Park*, " Exploiting π−π Stacking for Stretchable Semiconducting Polymers", Macromolecules, 51(7), 2572–2579, 2018.