S.-H. Kim, H. R. Lee, S. J. Yu, M.-E. Han, D. Y. Lee, S. Y. Kim, H.-J. Ahn, M.-J. Han, T.-I. Lee, T.-S. Kim, S. K. Kwon*, S.-G. Im*, N. S. Hwang*, “Hydrogel-laden paper scaffold system for origami-based tissue engineering,” Proc. Natl. Acad. Sci., 1504745112, 2015.

H. Eom, J.-H. Kim, J. Hur, T.-S. Kim, S.-K. Sung, J.-H. Choi, E. Lee, J.-H. Jeong*, and I. Park*, “Nanotextured Polymer Substrate for Flexible and Mechanically Robust Metal Electrodes by Nanoimprint Lithography”, ACS Applied Materials & Interfaces, 7, 25171-25179, 2015.

Y.-H. Lee, Y. Kim, T.-I. Lee, I. Lee, J. Shin, H. S. Lee, T.-S. Kim, and J. W. Choi*, “Anomalous Stretchable Conductivity Using an Engineered Tricot Weave”, ACS Nano, 9 (12), 12214–12223, 2015.

T. Kim, J.-H. Kim, T. E. Kang, C. Lee, H. Kang, M. Shin, C. Wang, B. Ma, U. Jeong, T.-S. Kim*, and B. J. Kim*, "Flexible, Highly Efficient All-Polymer Solar Cells", Nature Communications, 6, 8547, 2015.

J. H. Yun, I. Lee, T.-S. Kim, M. J. Ko, J. Y. Kim, and H. J. Son*, “Synergistic enhancement and mechanism study of mechanical and moisture stability of perovskite solar cells introducing polyethylene-imine into the CH3NH3PbI3/HTM interface,” Journal of Materials Chemistry A, 3, 22176, 2015.

J.-H. Kim, K.-S. Kim, K.-R. Jang, S.-B. Jung*, and T.-S. Kim*, “Enhancing Adhesion of Screen-Printed Silver Nanopaste Films,” Advanced Materials Interfaces, 2, 1500283, 2015.

J.-S. Kim+, J.-H. Kim+, W. Lee, H. Yu, H. J. Kim, I. Song, M. Shin, J. H. Oh, U. Jeong, T.-S. Kim*, and B. J. Kim*, “Tuning Mechanical and Opto-Electrical Properties of Poly(3-hexylthiophene) through Systematic Regioregularity Control,” Macromolecules, 48, 4339-4346, 2015.

C. Kim, T.-I. Lee, M.S. Kim*, and T.-S. Kim*, “Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates,” Polymers, 7(6), 985-1004, 2015.

Y.-H. Ko, M.-S. Kim, J. Bang, T.-S. Kim, and C.-W. Lee*, “Properties and Reliability of Solder Microbump Joints Between Si Chips and a Flexible Substrate,” Journal of Electronic Materials, 44 (7), 2458-2466, 2015.

A. Ito*, H.-S. Joo T.-S. Kim, T. Goto, “Synthesis of pseudobrookite titanium oxynitride Ti3−δO4N films by laser chemical vapor deposition,” Vacuum, 116, 121-123, 2015.

C.-C. Yu+, S. Kim+, J. D. Baek, Y. Li, P.-C. Su*, and T.-S. Kim*, “Direct Observation of Nanoscale Pt Electrode Agglomeration at the Triple Phase Boundary,” ACS Applied Materials & Interfaces, 7(11), 6036-6040, 2015.

Y. K. Jeong, T.-w. Kwon, I. Lee, T.-S. Kim, A. Coskun*, and J. W. Choi*, “Millipede-inspired Structural Design Principles for High Performance Polysaccharide Binders in Silicon Anodes,” Energy and Environmental Science, 8, 1224-1230, 2015.

D. J. Kang, H.-H. Cho, I. Lee, K.-H. Kim, H. J. Kim, K. Liao, T.-S. Kim, and B. J. Kim*, “Enhancing Mechanical Properties of Highly Efficient Polymer Solar Cells Using Size-Tuned Polymer Nanoparticles,” ACS Applied Materials & Interfaces, 7, 2668-2676, 2015.

J. Seo, W. S. Chang, and T.-S. Kim*, “Adhesion Improvement of Graphene/Copper Interface using UV/Ozone Treatments,” Thin Solid Films, 584, 170-175, 2015.

T.-W. Kwon, Y. K. Jeong, I. Lee, T.-S. Kim, J. W. Choi*, and A. Coskun*, “Systematic Molecular-Level Design of Binders Incorporating Meldrum`s Acid for Silicon Anodes in Lithium Rechargeable Batteries,” Advanced Materials, 26, 7979-7985, 2014.

H. J. Kim, J.-H. Kim, J.-H. Ryu, Y. Kim, H. Kang, W. B. Lee, T.-S. Kim*, and B. J. Kim*, “Architectural Engineering of Rod-Coil Compatibilizers for Producing Mechanically and Thermally Stable Polymer Solar Cells,” ACS Nano, 8(10), 10461-10470, 2014.

S. Kim, B.-H. Jeong, B. K. Hong*, and T.-S. Kim*, “Effects of hydrophobic agent content in macro-porous substrates on the fracture behavior of the gas diffusion layer for proton exchange membrane fuel cells,” Journal of Power Sources, 270, 342-348, 2014.

T. Yoon, W. S. Jo, and T.-S. Kim*, “High-Yield Etching-Free Transfer of Graphene: A Fracture Mechanics Approach,” Journal of the Microelectronics & Packaging Society, 21(2), 59-64, 2014.

I. Lee and T.-S. Kim*, “Thermal Assisted UV-Ozone Treatment to Improve Reliability of Ag Nanoparticle Thin Films,” Journal of the Microelectronics & Packaging Society, 21(1), 41-44, 2014.

J.-S. Kim, Y.-H. Lee, I. Lee, T.-S. Kim, M.-H. Ryou*, and J. W. Choi*, “Large Area Multi-stacked Lithium-ion Batteries for Flexible and Rollable Applications,” Journal of Materials Chemistry A, 2, 10862-10868, 2014.

S. Kim and T.-S. Kim*, “Adhesion improvement of silicon/underfill/polyimide interfaces by UV/ozone treatment and sol-gel derived hybrid layers,” Microelectronics Reliability, 54, 833-839, 2014.

Y. K. Jeong, T.-w. Kwon, I. Lee, T.-S. Kim, A. Coskun*, and J. W. Choi*, “Hyperbranched β-Cyclodextrin Polymer as an Effective Multidimensional Binder for Silicon Anodes in Lithium Rechargeable Batteries,” Nano Letters, 14, 864-870, 2014.

W. Jung+, T. Yoon+, J. Choi, S. Kim, Y. Kim*, T.-S. Kim* and C. Han*, “Superstrong encapsulated monolayer graphene by the modified anodic bonding,” Nanoscale, 6, 547-554, 2014.

T. Yoon, J. Moon, B. Cho*, and T.-S. Kim*, “Penetration and Lateral Diffusion Characteristics of Polycrystalline Graphene Barriers,” Nanoscale, 6, 151-156, 2014. (selected for "This week's HOT articles")

W. Jung, J. Park, T. Yoon, T.-S. Kim, S. Kim* and C. Han*, “Prevention of water permeation by strong adhesion between graphene and SiO2 substrate,” Small, 10(9), 1704-1711, 2014.

Y. Lee, J. Kim, J. Noh, I. Lee, H. Kim, S. Choi, J. Seo, M. Kim, S. Jeon, T.-S. Kim*, J. Lee*, and J. Choi*, “Wearable textile battery rechargeable by solar energy,” Nano Letters, 13(11), 5753-5761, 2013.

-The Most Read Article in Nano Letters in November 2013
-Featured in Nature [Link] 
-Selected as one of top 10 power management news in EE times Europe [Link]

W.C. Shin+, T. Yoon+, J.H. Mun, T.Y. Kim, S.Y. Choi, T.-S. Kim* and B.J. Cho*, “Doping suppression and mobility enhancement of graphene transistors fabricated using an adhesion promoting dry transfer process,” Applied Physics Letters, 103, 243504, 2013.

C. Lee, J.-H. Kim, C. Zou, I. Cho, J. Weisse, W. Nemeth, Q. Wang, A. van Duin, T.-S. Kim*, and X. Zheng* “Peel-and-Stick: Mechanism Study for Efficient Fabrication of Flexible/Transparent Thin-film Electronics,” Scientific Reports, 3, 2917, 2013.

J.-H. Kim, A. Nizami, Y. Hwangbo, B. Jang, H. Lee, C. Woo, S. Hyun*, and T.-S. Kim*, “Tensile Testing of Ultra-Thin Films on Water Surface,” Nature Communications, 4, 2520, 2013.

I. Lee+, J. Lee+, S. Ko*, and T.-S. Kim*, “Reinforcing Ag Nanoparticle Thin Films by Very Long Ag Nanowires,” Nanotechnology, 24, 415704, 2013.

J. Hwang, T. Yoon, S. Jin, J. Lee, T.-S. Kim, S. Hong*, and S. Jeon*, “Enhanced Mechanical Properties of Graphene/Copper Nanocomposites Using a Molecular-Level Mixing Process,” Advanced Materials, 25, 6724-6729, 2013. (Received the 2014 KINC Fusion Research Award)

J. Lee, P. Lee, H. Lee, S. Hong, I. Lee, J. Yeo, S. Lee, T.-S. Kim, D. Lee*, and S. Ko*, "Room-Temperature Nanosoldering of a Very Long Metal Nanowire Network by Conducting-Polymer-Assisted Joining for a Flexible Touch-Panel Application," Advanced Functional Materials, 23(34), 4171-7176,2013. (front cover)

J. Lee, I. Lee, T.-S. Kim, and J.-Y. Lee*, "Efficient Welding of Silver Nanowire Networks without Post-Processing," Small, 9(17), 2887-2894, 2013.

Y. Ko, M. Kim, T.-S. Kim, J. Bang, and C. Lee*, “Study on Joint of Micro Solder Bump for Application of Flexible Electronics,” Journal of the Korean Welding and Joining Society, 31(3), 4-10, 2013.

C. Kim, H. Choi, M. Kim, and T.-S. Kim*, “Packaging Substrate Bending Prediction due to Residual Stress,” Journal of the Microelectronics and Packaging Society, 20(1), 21-26, 2013.

M.-H. Ryou, J. Kim, I. Lee, S. Kim, Y. K. Jeong, S. Hong, J. H. Ryu, T.-S. Kim, J.-K. Park*, H. Lee*, J. W. Choi*, "Mussel-Inspired Adhesive Binders for High-Performance Silicon Nanoparticle Anodes in Lithium-Ion Batteries ," Advanced Materials, 25(11), 1571-1576, 2013. (frontpiece article)

S. Kim and T.-S. Kim*, “Adhesion Reliability Enhancement of Silicon/Epoxy/Polyimide Interfaces for Flexible Electronics,” Journal of the Microelectronics and Packaging Society, 19(3), 63-69, 2012.

Y. Ko, T.-S. Kim, Y. Lee, S. Yoo, and C. Lee*, “Reliability of High Temperature and Vibration in Sn3.5Ag and Sn0.7Cu Lead-free Solders," Journal of the Microelectronics and Packaging Society, 19(3), 31-36, 2012.

I. Lee+, S. Kim+, J. Yun, I. Park*, and T.-S. Kim*, “Interfacial toughening of solution processed Ag nanoparticle thin films by organic residuals,”Nanotechnology, 23, 485704, 2012.

T.-S. Kim*, “Adhesion Measurement Methods for Thin Films in Microelectronics,” Journal of the Korean Welding and Joining Society, 30(3), 213-218, 2012.

T. Yoon, W. C. Shin, T. Y. Kim, J. H. Mun, T.-S. Kim*, and B. J. Cho*, "Direct Measurement of Adhesion Energy of Monolayer Graphene As-Grown on Copper and Its Application to Renewable Transfer Process," Nano Letters, 12(3), 1448-1452, 2012. (Supporting Information)

T.-S. Kim and R. H. Dauskardt, "Molecular Mobility under Nanometer Scale Confinement," Nano Letters, 10(5), 1955-1959, 2010.

T.-S. Kim and R. H. Dauskardt*, "Integration Challenges of Nanoporous Low Dielectric Constant Materials," IEEE Transactions on Device and Materials Reliability, 9(4), 509-515, 2009.

T.-S. Kim, D. Chumakov, E. Zschech, and R. H. Dauskardt*, "Tailoring UV cure depth profiles for optimal mechanical properties of organosilicate thin films," Applied Physics Letters, 95, 071902, 2009.

T.-S. Kim, T. Konno, and R. H. Dauskardt*, "Surfactant-Controlled Damage Evolution during Chemical Mechanical Planarization of Nanoporous Films," Acta Materialia, 57, 4687-4696, 2009.

T.-S. Kim, K. Mackie, Q. Zhong, M. Peterson, T. Konno, and R. H. Dauskardt*, "Surfactant Mobility in Nanoporous Glass," Nano Letters, 9(6), 2427-2432, 2009.

T.-S. Kim, N. Tsuji, K. Matsushita, N. Kobayashi, D. Chumakov, H. Geisler, E. Zschech, and R. H. Dauskardt*, "Tuning depth profiles of organosilicate films with ultraviolet curing," Journal of Applied Physics, 104, 074113, 2008.

T.-S. Kim, N. Tsuji, N. Kemeling, K. Matsushita, D. Chumakov, H. Geisler, E. Zschech, and R. H. Dauskardt*, "Depth dependence of ultraviolet curing of organosilicate low-k thin films," Journal of Applied Physics, 103, 064108, 2008.

D. Han, H. Park, Y. Park, T.-S. Kim, W. Yoon, J. Kim, and J. Park*, "Beneficial Effects of Freezing Rate Determined by Indirect Thermophysical Calculation on Cell Viability in Cryopreserved Tissues," Artificial Cells, Blood Substitutes, and Biotechnology, 34(2), 205-221, 2006.

H. Park, Y. Park*, W. Yoon, T.-S. Kim, C. Yoon, S. Kim, S. Lim, J. Kim, Y. Kwak, D. Han, J. Park, and B. Cho, "Ideal Freezing Curve Can Avoid the Damage by Latent Heat of Fusion During Freezing," Korean J. Thorac. Cardiovasc. Surg., 36(4), 219-228, 2003.