S. Kang, J. Kim, J.-B. Pyo, J. H. Cho, and T.-S. Kim*,“Design of Magnetic Force Field for Trajectory Control of Levitated Diamagnetic Graphite”, International Journal of Precision Engineering and Manufacturing-Green Technology, 5, 341-347, 2018.

W. Lee, J.-H. Kim, T. Kim, S. Kim, C. Lee, J.-S. Kim, H. Ahn, T.-S. Kim, B. J. Kim*, "Mechanically Robust and High-Performance Solar Cells Combining the Merits of All-Polymer and Fullerene Blends”, Journal of Materials Chemistry A, 6, 4494-4503, 2018.

Y. Kim, Y. Kim, T.-I. Lee, T.-S. Kim, S. Ryu*, “An Extended Analytic Model for the Elastic Properties of Platelet-Staggered Composites and Its Application to 3D Printed Structures”, Composite Structures, 189, 27-36, 2018.

I.-J. Park, T. I. Kim, T. Yoon, S. Kang, H. Cho, N. S. Cho, J.-I. Lee, T.-S. Kim, and S.-Y. Choi*,“Flexible and Transparent Graphene Electrode Architecture with Selective Defect Decoration for Organic Light-Emitting Diodes”, Advanced Functional Materials, 28, 1704435, 2018.

J.-W. Shin, J.-H. Han, H. Cho, J. Moon, B.-H. Kwon, S. Cho, T. Yoon, T.-S. Kim, M. Suemitsu, J.-I. Lee, and N. S. Cho*, “Display process compatible accurate graphene patterning for OLED applications”, 2D Materials, 5, 014003, 2018.

S. Jang, C. Kim, J. J. Park, M. L. Jin, S. J. Kim, O. O. Park, T.-S. Kim and H.-T Jung*, “A High Aspect Ratio Serpentine Structure for Use As a Strain-Insensitive, Stretchable Transparent Conductor”, Small, 1702818, 2018.

H. J. Han, J. W. Jeong, S. R. Yang, C. Kim, H. G. Yoo, J.-B. Yoon, J. H. Park, K. J. Lee, T.-S. Kim, S.-W. Kim, and Y.S. Jung*, “Nanotransplantation Printing of Crystallographic-Orientation-Controlled Single-Crystalline Nanowire Arrays on Diverse Surfaces”, ACS Nano, 11, 11642-11652, 2017.

Y. S. Oh, H. Choi, J. Lee, H. Lee, D. Y. Choi, S.-U. Lee, K.-S. Yun, S. Yoo, T.-S. Kim, I. Park*, and H. J. Sung*, “Temperature-Controlled Direct Imprinting of Ag Ionic Ink: Flexible Metal Grid Transparent Conductors with Enhanced Electromechanical Durability”, Scientific Reports, 7, 11220, 2017.

I. Lee, J. Noh, J.-Y. Lee*, and T.-S. Kim*, “Co-optimization of Adhesion and Power Conversion Efficiency of Organic Solar Cells by Controlling Surface Energy of Buffer Layers”, ACS Applied Materials & Interfaces, 9, 37395-37401, 2017.

S.-Y. Kim, J.H. Bong, C. Kim, W.S. Hwang, T.-S. Kim, B.J. Cho*, “Mechanical Stability Analysis via Neutral Mechanical Plane for High-Performance Flexible Si Nanomembrane FDSOI Device”, Advanced Materials Interfaces , 4, 1700618, 2017.

J.-H. Kim+, T.-I. Lee+, T.-S. Kim, K.-W. Paik*, “The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications”, IEEE Trans. Compon., Packag., Manuf. Technol., 7(10), 1583-1591, 2017.

W. Jo, J. Seo, and T.-S. Kim*, “Manufacturing of Metal Micro-wire Interconnection on Submillimeter Diameter Catheter”, Journal of the Microelectronics and Packaging Society, 24(2), 29-35, 2017.

T.-I. Lee, C. Kim, J.-B. Pyo, M.S. Kim*, and T.-S. Kim*, “Effect of Anisotropic Thermo-Elastic Properties of Woven-Fabric Laminates on Diagonal Warpage of Thin Package Substrates”, Composite Structures, 176, 973-981, 2017.

C. Kim, T.-I. Lee, M.S. Kim*, and T.-S. Kim*, “Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing”, Microelectronics Reliability, 73, 136-145, 2017.

T. Yoon, T.-S. Kim*, “Thermo-Mechanical Reliability of TSV based 3D-IC”, Journal of the Microelectronics and Packaging Society, 24(1), 35-43, 2017.

J. Park, S. Han, D. Kim, B. You, S. Hong, J. Seo, J. Kwon, C. Jeong, H. Park, T.-S. Kim, S. Ko*, K. Lee*, “Plasmonic-Tuned Flash Cu Nanowelding for Ultrafast Photochemical-Reducing and Interlocking on Flexible Plastics”, Advanced Functional Materials, 1701138, 2017.

W. Kim+, I. Lee+, D.-Y. Kim, Y.-Y. Yu, H.-Y. Jung, S. Kwon, W.-S. Park, T.-S. Kim*, “Controlled multiple neutral planes by low elastic modulus adhesive for flexible organic photovoltaics”, Nanotechnology, 28, 194002, 2017.

J.-H. Kim+, J. Noh+, H. Choi, J.-Y. Lee*, T.-S. Kim*, “Mechanical Properties of Polymer-Fullerene Bulk Heterojunction Films: Role of Nanomorphology of Composite Films”, Chemistry of Materials, 29(9), 3954-3961, 2017.

H. J. Kim, M. Y. Lee, J.-S. Kim, J.-S. Kim, J.-H. Kim, H. Yu, H. Yun, K. Liao, T.-S. Kim*, J. H. Oh*, B. J. Kim*, “Solution-Assembled Blends of Regioregularity Controlled Polythiophenes for Coexistence of Mechanical Resilience and Electronic Performance”, ACS Applied Materials & Interfaces, 9(16), 14120-14128, 2017.

J. Kim+, C. Kim+, Y. Song, S.-G. Jeong, T.-S. Kim*, C.-S. Lee*, “Reversible Self-Bending Soft Hydrogel Microstructures with Mechanically Optimized Designs”, Chemical Engineering Journal, 321, 384-393, 2017.

Y. Kim, T. Yoon, T.-W. Kim, T.-S. Kim, K.-W. Paik*, “Moisture Effects on NCF Adhesion and Solder Joint Reliability of Chip-on-Board Assembly Using Cu Pillar/Sn-Ag Microbump”, IEEE Trans. Compon., Packag., Manuf. Technol., 7(3), 371-378, 2017.

K.-L. Jang+, S. Kim+, B.-H. Jeong, J.-G. Oh, B. K. Hong*, T.-S. Kim*, “Electromechanical diagnostic method for monitoring cracks in polymer electrolyte fuel cell electrodes”, International Journal of Hydrogen Energy, 42(16), 11644-11653, 2017.

D. Rodriquez+, J.-H. Kim+, S. E. Root, Z. Pei, P. Boufflet, M. Heeney, T.-S. Kim*, D. J. Lipomi*, “Comparison of Methods for Determining the Mechanical Properties of Semiconducting Polymer Films for Stretchable Electronics”, ACS Applied Materials & Interfaces, 9(10), 8855-8862, 2017.

I. Lee, J. H. Yun, H. J. Son, T.-S. Kim*, “Accelerated Degradation Due to Weakened Adhesion from Li-TFSI Additives in Perovskite Solar Cells”, ACS Applied Materials & Interfaces, 9(8), 7029-7035, 2017.

J.-H. Kim, I. Lee, T.-S. Kim*, N. Rolston, B. L. Watson, and R. H. Dauskardt*, “Understanding mechanical behavior and reliability of organic electronic materials”, MRS Bulletin, 42(2), 115-123, 2017.

M. Yang, Y.-H. Ko, J. Bang, T.-S. Kim, C.-W. Lee*, S. Zhang, M. Li*, “Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates”, Journal of Alloys and Compounds, 701, 533-541, 2017.

M. Yang, Y.-H. Ko, J. Bang, T.-S. Kim, C.-W. Lee*, M. Li*, “Effects of Ag addition on solid–state interfacial reactions between Sn–Ag–Cu solder and Cu substrate”, Materials Characterization, 124, 250-259, 2017.

J.H. Bong+, C. Kim+, W.S. Hwang, T.-S. Kim*, and B.J. Cho*, “A Quantitative Strain Analysis of a Flexible Single-Crystalline Silicon Membrane”, Applied Physics Letters, 110(3), 033105, 2017.

J.-W. Seo, M. Joo, J. Ahn, T.-I. Lee, T.-S. Kim, S. G. Im*, and J.-Y. Lee*, “Facilitated Embedding of Silver Nanowires into Conformally-Coated iCVD Polymer Films Deposited on Cloths for Robust Wearable Electronics”, Nanoscale, 9(10), 3399-3407, 2017.

J. H. Park, G.-T. Hwang, S. Kim, J. Seo, H.-J. Park, K. Yu, T.-S. Kim, and K.-J. Lee*, “Flash-Induced Self-Limited Plasmonic Welding of Silver Nanowire Network for Transparent Flexible Energy Harvester”, Advanced Materials, 29(5), 1603473, 2017.

T.-I. Lee, C. Kim, M.S. Kim*, and T.-S. Kim*, “Measurement of Flexural Modulus of Lamination Layers on Flexible Substrates ”, Journal of the Microelectronics & Packaging Society, 23(3), 63-67, 2016.

T.-W. Kim, T.-I. Lee, Y. Pan, W. Kim, S. Zhang, T.-S. Kim, and K.-W. Paik*, “Effect of Nanofiber Orientation on Nanofiber Solder Anisotropic Conductive Films Joint Properties and Bending Reliability of Flex-on-Flex Assembly”, IEEE Trans. Compon., Packag., Manuf. Technol., 6(9), 1317-1329, 2016.

C. Kim, T.-I. Lee, and T.-S. Kim*, “Measurement Technologies of Mechanical Properties of Polymers used for Flexible and Stretchable Electronic Packaging”, Journal of the Microelectronics & Packaging Society, 23(2), 19-28, 2016.

Y.-H. Ko, K. Choi, S. W. Kim, D.-Y. Yu, J. Bang, and T.-S. Kim*, “Trends of Researches and Technologies of Electronic Packaging Using Graphene”, Journal of the Microelectronics & Packaging Society, 23(2), 1-10, 2016.

J. Ahn, J.-W. Seo, T.-I. Lee, D. Kwon, I. Park, T.-S. Kim, and J.-Y. Lee*, “Extremely Robust and Patternable Electrodes for Copy-Paper-Based Electronics”, ACS Applied Materials & Interfaces, 19031-19037, 2016.

S. Jang, W. -B. Jung, C. Kim, P. Won, S.-G. Lee, K. M. Cho, M. L. Jin, C. J. An, H.-J. Jeon, S. H. Ko, T.-S. Kim, and H.-T. Jung*, “A three-dimensional metal grid mesh as a practical alternative to ITO”, Nanoscale, 14257-14263, 2016.

D. Kwon, T.-I. Lee, J. Shim, S. Ryu, M. S. Kim, S. Kim, T.-S. Kim, I. Park*, “Highly Sensitive, Flexible and Wearable Pressure Sensor Based on a Giant Piezocapacitive Effect of Three-Dimensional Microporous Elastomeric Dielectric Layer”, ACS Applied Materials & Interfaces, 16922-16931, 2016.

J. Lee, T.-H. Han, M.-H. Park, Y. Jung, J. Seo, H.-K. Seo, H. Cho, E. Kim, J. Chung, S.-Y. Choi, T.-S. Kim, T.-W. Lee*, and S. Yoo*, “Synergetic electrode architecture for efficient graphene-based flexible organic light-emitting diodes”, Nature Communications, 7, 11791, 2016.

T.-I. Lee, C. Kim, M.S. Kim*, and T.-S. Kim*, “Flexural and Tensile Moduli of Flexible FR4 Substrates”, Polymer Testing, 53, 70-76, 2016.

S. Kim+, J.-H. Kim+, J.-G. Oh, K.-L. Jang, B.-H. Jeong, B.K. Hong*, and T.-S. Kim*, “Mechanical Behavior of Free-Standing Fuel Cell Electrodes on Water Surface”, ACS Applied Materials & Interfaces, 15391-15398, 2016.

J.-B. Pyo, T.-I. Lee, C. Kim, M.S. Kim*, and T.-S. Kim*, “Prediction of time-dependent swelling of flexible polymer substrates using hygro-mechanical finite element simulations”, Soft Matter, 12, 4135-4141, 2016.

M.S. Oh, Y.S. Song, C. Kim, J. Kim, J.B. You, T.-S. Kim, C.-S Lee*, and S.G. Im*, “Control of Reversible Self-Bending Behavior in Responsive Janus Microstrips”, ACS Applied Materials & Interfaces, 8782-8788, 2016.

T.-I. Lee, M.S. Kim*, and T.-S. Kim*, “Contact-Free Thermal Expansion Measurement of Very Soft Elastomers using Digital Image Correlation”, Polymer Testing, 51, 181-189, 2016.

Y.-H. Ko, J.-D. Lee, T. Yoon, C.-W. Lee, and T.-S. Kim*, “Controlling Interfacial Reactions and Intermetallic Compound Growth at the Interface of a Lead-free Solder Joint with Layer-by-Layer Transferred Graphene”, ACS Applied Materials & Interfaces, 8 (8), 5679–5686, 2016.

J.-H. Kim+, T.-I. Lee+, J.-W. Shin, T.-S. Kim, and K.-W. Paik*, “Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications”, IEEE Trans. Compon., Packag., Manuf. Technol., 6(2), 208-215, 2016.

Y.-L. Kim+, T.-I. Lee+, J.-H. Kim, W. Kim, T.-S. Kim, and K.-W. Paik*, “Effects of the Mechanical Properties of Polymer Resin and the Conductive Ball Types of Anisotropic Conductive Films on the Bending Properties of Chip-in-Flex Package”, IEEE Trans. Compon., Packag., Manuf. Technol., 6(2), 200-207, 2016.

T. Yoon, J.-H. Kim, J.H. Choi, D.Y. Jung, I.-J. Park, S.-Y. Choi, N.S. Cho, J.-I. Lee, Y.-D. Kwon, S. Cho, and T.-S. Kim*, “Healing Graphene Defects using Selective Electrochemical Deposition: Toward Flexible and Stretchable Devices,” ACS Nano, 10, 1539-1545, 2016.

I. Lee+, G. W. Kim+, M. Yang, and T.-S. Kim*, “Simultaneously Enhancing the Cohesion and Electrical Conductivity of PEDOT:PSS Conductive Polymer Films using DMSO Additives,” ACS Applied Materials & Interfaces, 8(1), 302-310, 2016.