> International Conference Proceedings and Presentations

94.
B. S. Ma and T.-S. Kim, "Mechanically Reliable Mechanism using Torsion Spring and Compliant Adhesive for Rollable Display", The 16th International Symposium on Microelectronics and Packaging, Seoul, Korea, Oct. 17-19, 2017.
93.
S. Kang, T. Yoon and T.-S. Kim, "A study on rate-dependent mechanical transfer of synthesized multilayer graphene considering crack deflection effect", The 16th International Symposium on Microelectronics and Packaging, Seoul, Korea, Oct. 17-19, 2017.
92.
T. Y. Kang, D. Seo, T. Yoon, S. Kang, and T.-S. Kim, "Detection of cracks in graphene by scattering parameter measurements", CARBON 2017, Melbourne, Australia, July 23-28, 2017.
91.
S. Kang, T. Yoon, T. Y. Kang, and T.-S. Kim, "Non-Destructive Measurement of Graphene Defects using Induced Voltage", CARBON 2017, Melbourne, Australia, July 23-28, 2017.
90.
S.-H. Heo, C. Kim, D.H. Kim, T.-S. Kim, and H.-S. Park, "Three-Layered Biomimetic Skin Pad for Hand Prosthetics", ISNIT 2017, Cebu, Philippine, 2017/06/28-7/01.
89.
J.H. Shin, W. Kim, G.-M. Choi, T.-S. Kim, and B.-S. Bae, "Optimization of Multilayer Inorganic/Organic Thin Film Structure for Foldable Barrier Films", SID 2017, Los Angeles, United States of America, 2017/05/22-26.
88.
C. Kim, T.-I. Lee, M.S. Kim, and T.-S. Kim, “FEM Simulation of Warpage Orientation Change of FRP Polymer Substrate during Thermal Processing”, ICEP 2017, Yamagata, Japan, 2017/04/19-22.
87.
T.-I. Lee, C. Kim, J.-B. Pyo, M.S. Kim, and T.-S. Kim, “Effect of Anisotropic Mechanical Properties of Woven Composite Substrates on Warpage Orientation of Printed Circuit Boards”, ICEP 2017, Yamagata, Japan, 2017/04/19-22.
86.
H. Choi, J.-H. Kim and T.-S. Kim, “Adhesion of Silver Ion Ink Films on Flexible Substrates”, ACEM2016, Jeju, Korea, Nov. 14-16, 2016.
85.
W. Kim, I. Lee and T.-S. Kim, “Controlled Multiple Neutral Planes by Low Elastic Modulus Adhesive”, ACEM2016, Jeju, Korea, Nov. 14-16, 2016.
84.
S. Kang, T. Yoon and T.-S. Kim, "Etching-Free Mechanical Transfer and Adhesion Measurement of Multilayer Graphene As-Grown on Nickel", The 15th International Symposium on Microelectronics and Packaging, Seoul, Korea, Oct. 24-26, 2016.
83.
T. Yoon and T.-S. Kim, "Selective Electrodeposition of Metals to Heal Graphene Defects", 8th International Conference on Recent Progress in Graphene/2D Research, Seoul, Korea, Sep. 25-29, 2016.
82.
J. Seo, C.-G. Kim, B.S. Ma and T.-S. Kim, "High-yield, polymer-free dry transfer of graphene with controlled strain rate and modulus of PDMS stamp", 8th International Conference on Recent Progress in Graphene/2D Research, Seoul, Korea, Sep. 25-29, 2016.
81.
T.-S. Kim, "Mechanical Properties of Functional Thin Films for Flexible Devices," UKC 2016, Dallas, Texas, USA, Aug. 10-13, 2016. (Invited)
80.
Seunghwan Kim, Morteza Amzadi, Tae-Ik Lee, Yongrok Jeong, Donguk Kwon, Min Seong Kim, Taek-Soo Kim and Inkyu Park*, "A Flexible Piezoresistive Pressure Sensor Based on Carbon Nanotube-Coated Porous Elastomer and Development of Flexible Piano Pad”, APCOT2016, Kanazawa, Japan, June 26-29, 2016.
79.
T.-S. Kim, "Mechanical Properties of Functional Thin Films for Flexible Devices," 2016 Energy Materials Nanotechnology (EMN) Summer Meeting, Cancun, Mexico, June 8-11, 2016. (Invited)
78.
J.-H. Kim, T.-I. Lee, T.-S. Kim, and K.-W. Paik, "Adhesion Properties of Anisotropic Conductive Films (ACFs) Assembled Chip-In-Flex (CIF) Packages for Wearable Electronics Applications", 66th Electronic Components and Technology Conference, Las Vegas, Nevada, USA, May 31 - June 3, 2016.
77.
T.-S. Kim, "Mechanical Reliability of Advanced Thin Films for Flexible Devices", 2016 International Conference on Electronics Packaging, Sapporo, Japan, Apr. 20-22, 2016. (Invited)
76.
T. Kim, J.-H. Kim, T. E. Kang, C. Lee, H. Kang, M. Shin, C. Wang, B. Ma, U. Jeong, T.-S. Kim, and B. J. Kim, "All Polymer Solar Cells: Overcoming Mutual Exclusiveness between Photovoltaic Efficiency and Mechanical Stability," 2016 Global Photovoltaic Conference, Daegu, Korea, Apr. 6-8, 2016.
75.
T.-I. Lee, C. Kim, M.S. Kim, and T.-S. Kim, "Measuring Coefficient of Thermal Expansion of Silicone Elastomers in a Very Wide Range of Modulus by Digital Image Correlation", 2016 MRS Spring Meeting & Exhibit, Phoenix, Arizona, USA, Mar. 28 - Apr. 1, 2016.
74.
S. J. Yu, S.-H. Kim, H. R. Lee, M.-E. Han, T.-I. Lee, T.-S. Kim, S. K. Kwon, N. S. Hwang, and S. G. Im, "Hydrogel-Laden Paper Scaffolds for Origami-Based Tissue Engineering", 2015 MRS Fall Meeting & Exhibit, Boston, Massachusetts, USA, Nov. 29 - Dec. 4, 2015.
73.
C. Lee, T. Kim, J.-H. Kim, T.-S. Kim, B. Kim, "Highly Efficient All-Polymer Solar Cells: Better Flexible Photovoltaic Devices Than Polymer-Fullerene Ones", 25th International Photovoltaic Science & Engineering Conference, Busan, Korea, Nov. 15-20, 2015.
72.
S. Kim and T.-S. Kim, "Solving Adhesion and Reliability Issues for Fuel Cells", The Fourth International Forum on Environment and Energy Science, Hawaii, USA, Dec. 6-10, 2015.
71.
J. Seo, W.S. Jo, S.M. Lee, and T.-S. Kim, "Tensile Testing of Submicron Thick Free-standing Metal Thin Films without Etching Process", The 3rd International Conference on Materials and Reliability, Jeju, Korea, Nov. 23-25, 2015.
70.
T. Yoon, W.S. Jo, and T.-S. Kim, “High-Yield Etching-Free Transfer of Graphene: Stress and Fracture Mechanical Approach”, The 14th International Symposium on Microelectronics and Packaging, Ilsan, Korea, Oct. 13-15, 2015.
69.
T.-I. Lee, C. Kim, M.S. Kim, and T.-S. Kim, "A Non-contact Method to Measure Thermal Expansion Coefficient of PDMS for Soft Electronics", The 14th International Symposium on Microelectronics and Packaging, Ilsan, Korea, October 13-15, 2015.
68.
J.-H. Kim, T.-I. Lee, J.-W. Shin, T.-S. Kim, and K.-W. Paik, “Ultra-Thin Chip-in-Flex (CIF) technology using Anisotropic Conductive Films (ACFs) for Wearable Electronics Applications”, The 14th International Symposium on Microelectronics and Packaging, Ilsan, Korea, October 13-15, 2015.
67.
T.-W. Kim, T.-I. Lee, S.-H. Lee, T.-S. Kim, and K.-W. Paik, "Study on Bending Feasibility and Joint Reliability for Fine Pitch Flex-on-Flex (FOF) Assembly using Nanofiber Solder Anisotropic Conductive Films (ACFs) and Ultrasonic (US) Bonding", ISMP 2015, Ilsan, Korea, October 13-15, 2015.
66.
J.-H. Kim, K.-S. Kim, K.-R. Jang, S.-B. Jung, and T.-S. Kim, “Adhesion Characteristics of Screen-printed Ag Nanopaste Thin Films", 17th International Conference on Electronics Materials and Packaging, Portland, OR, USA, September 1-4, 2015. (Outstanding Student Paper Award)
65.
J. Seo and T.-S. Kim, “Floating Transfer of Residual-Free Graphene using Water Surface”, CARBON 2015, Dresden, Germany, July 12-17, 2015.
64.
S. Kim, B.-H. Jeong, B.K. Hong, and T.-S. Kim, “Effects of Hydrophobic Agent Content in Macro-Porous Substrates on the Fracture Behavior of the Gas Diffusion Layer for PEMFC”, CARBON 2015, Dresden, Germany, July 13-17, 2015.
63.
T. Yoon and T.-S. Kim, “Visualization and Healing of Graphene Defects”, CARBON 2015, Dresden, Germany, July 12-17, 2015.
62.
S. Kim, K.J. Yoon, J.-W. Son, and T.-S. Kim, “Development of Quantitative Adhesion Measurement Method for SOFC”, The 13th International Nanotech Symposium & Nano-Convergence Expo Nano Korea 2015, Seoul, Korea, July 1-3, 2015.
61.
K.-R. Jang, K.J. Yoon, J.-W. Son, and T.-S. Kim, “Moisture-Assisted Interfacial Crack Growth of SOFC”, The 13th International Nanotech Symposium & Nano-Convergence Expo Nano Korea 2015, Seoul, Korea, July 1-3, 2015.
60.
J.-H. Kim, T.-I. Lee, J.-W. Shin, T.-S. Kim, and K.-W. Paik, “Ultra-Thin Chip-in-Flex (CIF) technology using Anisotropic Conductive Films (ACFs) for Wearable Electronics Applications”, 65th Electronic Components and Technology Conference, San Diego, California, USA, May 26-29, 2015.
59.
D. Kwon, T.-I. Lee, M.S. Kim, S. Kim, T.-S. Kim, and I. Park, “Porous Dielectric Elastomer Based Ultra-Sensitive Capacitive Pressure Sensor and Its Application to Wearable Sensing Device”, Transducer, Alaska, USA, June 21-25, 2015.
58.
T.-S. Kim, “Mechanical Reliability of Advanced Thin Films,” International Conference on Electronic Packaging, Kyoto, Japan, April 16, 2015. (Invited)
57.
I. Lee, G.W. Kim, M. Yang, and T.-S. Kim, “Exploiting DMSO to Enhance Mechanical and Electrical Properties of PEDOT:PSS Conducting Polymer Films,” Materials Research Society Spring Meeting, San Francisco, USA, April 06-10, 2015.
56.
J.-S. Kim, J.-H. Kim, W. Lee, H. Yu, H. J. Kim, I. Song, J. H. Oh, T.-S. Kim, and B. Kim, “Facile Control of a Wide Range of Regioregularity: Significant Influence on Mechanical and Electrical Properties of Conjugated Polymers,” American Physical Society March Meeting, Texas, USA, Mar. 02-06, 2015.
55.
T.-S. Kim, “Mechanical Reliability of Advanced Thin Films”, International Conference on Electronic Materials and Nanotechnology for Green Environment, Jeju, Korea, 2014/11/16-11/19. (Invited)
54.
T.-I. Lee, C. Kim, M.S. Kim and T.-S. Kim, “Flexural Modulus Measurement and Warpage Analysis of Multilayers on Polymer Composite Substrates for Flexible Electronics”,International Conference on Electronic Materials and Nanotechnology for Green Environment, Jeju, Korea, 2014/11/16-11/19.
53.
J.-B. Pyo, T.-I. Lee, C. Kim, M.S. Kim and T.-S. Kim, “Effect of Moisture Absorption on the Warpage of Flexible Polymer Substrates”,International Conference on Electronic Materials and Nanotechnology for Green Environment, Jeju, Korea, 2014/11/16-11/19.
52.
J.-H. Kim, K.-R. Jang, and T.-S. Kim, "Measurement of Mechanical Properties of Advanced Ultra-Thin Films using Water surface Platform," International Conference on Experimental Mechanics 2014, Singapore, November 14-17, 2014.
51.
C. Kim, T. Lee, M.S. Kim, and T.-S. Kim, "Warpage analysis of electroplated Cu and solder resist films on polymer based packaging substrate," International Conference on Experimental Mechanics 2014, Singapore, November 14-17, 2014.
50.
D. Kwon, T. Lee, M. Amjadi, S. Kim, M. S. Kim, T.-S. Kim and I. Park, "A highly sensitive, flexible capacitive pressure sensor based on porous dielectric elastomer", 40th Micro and Nano Engineering, Lausanne, Switzerland, Sep. 25, 2014.
49.
J. Seo and T.-S. Kim, “Effect of UV/Ozone Treatment on Interfacial Adhesion of Multilayer Graphene,” The 7th International Conference on Technological Advances of Thin Films & Surface Coatings, Chongqing, China, July 15-18, 2014.
48.
T.-S. Kim, “Adhesion of Advanced Thin Films,” The 7th International Conference on Technological Advances of Thin Films & Surface Coatings, Chongqing, China, July 15-18, 2014. (Invited)
47.
T. Yoon and T.-S. Kim, “Interfacial adhesion and diffusion barrier characteristics of graphene layer,” 67th IIW International Conference, Seoul, July 17-18, 2014.
46.
S. Kim and T.-S. Kim, “Adhesion improvement of silicon/underfill/polyimide interfaces by UV/ozone treatment and sol-gel derived hybrid layers,” 67th IIW International Conference, Seoul, July 17-18, 2014.
45.
T. Yoon, B.J. Cho, and T.-S. Kim, “Interfacial adhesion and diffusion barrier characteristics of synthesized graphene,” 2014 The World Conference on Carbon, Jeju, Korea, June 29-July 4, 2014.
44.
C. Kim, T. Lee, H.S. Choi, M.S. Kim, and T.-S. Kim, "Methodology Development of Warpage Analysis of Polymer Based Packaging Substrate," 64th Electronic Components and Technology Conference, Orlando, FL, USA, May 27-30, 2014.
43.
J. W. Choi, Y.-H. Lee, J.-S. Kim, J. Noh, T.-S. Kim, and J.-Y. Lee, “Solar-Rechargeable Wearable Textile Battery,” 2014 Materials Research Society Spring Meeting, San Francisco, USA, April 21-25, 2014.
42.
Y. Ko, T.-S. Kim, and C. Lee, “Evaluation on Property and Reliability of Micro-bump Joint between Si Chip and Flexible Substrate,” TMS 2014 143rd Annual Meeting, San Diego, CA, USA, February 16-20, 2014.
41.
T. Yoon, W.C. Shin, J.H. Mun, B.J. Cho and T.-S. Kim, “Adhesion Characteristic of Graphene Synthesized on Cu”, Materials Research Society Fall Meeting, Boston, MA, USA, December 1-6, 2013.
40.
T.-S. Kim, “Adhesion Reliability of Advanced Thin Films,” 15th International Conference on Electronic Materials and Packaging, Ilsan, Korea, Oct. 6-9, 2013. (Invited)
39.
Lee, J. Lee, S. Ko, and T.-S. Kim, “Thermal Assisted UV-Ozone Treatment to Improve Reliability of Ag Nanoparticle Thin Films,” 15th International Conference on Electronic Materials and Packaging, Ilsan, Korea, Oct. 6-9, 2013.
38.
Y. Ko, M. Kim, T.-S. Kim, J. Bang, and C. Lee, “Evaluation on Property and Reliability of Micro-bump Joint between Si chip and Flexible Substrate,” 15th International Conference on Electronic Materials and Packaging, Ilsan, Korea, Oct. 6-9, 2013.
37.
J. Seo, W. Chang, and T.-S. Kim, “Research on the Adhesion Change of Graphene/Cu Interface by UV/Ozone Treatment,” NANO KOREA 2013 Symposium, Seoul, Korea, July 10-12, 2013.
36.
S. Kim, S. Won, I. Lee, T.-S. Kim, S. Lee, I. Park, “Adhesion and tensile characteristics of solution-processed Ag nanoparticle thin films," 2012 MRS Fall Meeting, Boston, MA, USA. Nov. 25-30, 2012.
35.
S. Kim and T.-S. Kim, “Adhesion Reliability Enhancement of Silicon/Epoxy/Polyimide Interfaces for Flexible Electronics," International Workshop on Advanced Packaging & System Technology, Jeju, Korea, Nov. 22-24, 2012.
34.
T.-S. Kim, “Mechanical Reliability of Advanced Thin Films,” KU-ETHZ International Micro SOFC Workshop, Seoul, Korea, Oct. 16, 2012.
33.
J. Kim, A. Nizami, H. Lee, C. Woo, S. Hyun, and T.-S. Kim, “Development of Thin Gold Film Tensile Testing by Floating Specimen on Water Surface,” The Electrochemical Society Meeting, Honolulu, HI, USA, Oct. 7-12, 2012.
32.
T. Yoon, W. Shin, T. Y. Kim, J. Mun, B. Cho, and T.-S. Kim, “Adhesion Energy and Etching-Free Renewable Transfer of Graphene As-Grown on Copper,” The Electrochemical Society Meeting, Honolulu, HI, USA, Oct. 7-12, 2012.
31.
C. Kim, S. Jeon, H. Lee, S. Hyun, and T.-S. Kim, “Direct Measurement and Enhancement of Adhesion Energy of Bi-Te Thermoelectric Thin Films,” The Electrochemical Society Meeting, Honolulu, HI, USA, Oct. 7-12, 2012.
30.
I. Lee, S. Kim, J. Yun, I. Park, and T.-S. Kim, “Annealing-induced interfacial fracture energy of silver nanoparticle films on substrate for reliable printed electronics,” The Electrochemical Society Meeting, Honolulu, HI, USA, Oct. 7-12, 2012.
29.
S. Kim and T.-S. Kim, “Adhesion Reliability Enhancement of Silicon/Epoxy/Polyimide Interfaces for Flexible Electronics,” The Electrochemical Society Meeting, Honolulu, HI, USA, Oct. 7-12, 2012.
28.
T.-S. Kim, “Mechanical Reliability of Advanced Thin Films,” JSME-CMD International Computational Mechanics Symposium, Kobe, Japan, Oct. 11, 2012.
27.

T. Yoon, I. Lee, and T.-S. Kim, “Mechanical Reliability of Cu/Low-k Interconnects and Underfill,” IEEE International 3D System Integration Conference, Osaka, Japan, Jan. 31 - Feb. 2, 2012.

26.
T.-S. Kim, "Mechanical Reliability of Flip-Chip Packaging: from Cu/Low-k Interconnects to Underfill,” The 10th International Symposium on Microelectronics and Packaging, Ilsan, Korea, Oct. 12, 2011. (Invited)
25.
A. Park, S. Kim, C. Yoo, and T.-S. Kim, “Development of Inclined Conductive Bump (ICB) for Electronic Packaging,” The 61st Electronic Components and Technology Conference, Lake Buena Vista, Florida, USA, May 31 – June 3, 2011.
24.
T.-S. Kim, M. Giachino, N. Ananthakrishnan, S. M. Liff, and R. H. Dauskardt, “Functionally Graded Hybrid Layers for High-Performance Polymer/Silicon Adhesion,” Materials Research Society Spring Meeting, San Francisco, CA, April 25-29, 2011.
23.
K. B. Yeap, U. Hangen, Y. Ritz, T.-S. Kim, R. H. Dauskardt, E. Zschech, “Cohesive Toughness of Low-k Film with Periodically Changing Elastic Modulus: Cube-Corner Indentation,” Proceedings of Stress-Induced Phenomena in Metallization: 11th International Workshop, 159-165, 2010.
22.
T.-S. Kim, “Mechanical Reliability of Flip-Chip Packaging: from Cu/Low-k Interconnects to Underfill,” Korea-SV Electronics Packaging Technology Workshop, Santa Clara, CA, Oct. 21, 2010. (Invited)
21.
T.-S. Kim and R. H. Dauskardt, "Molecular Diffusion under Nanometer Scale Confinement during CMP of Nanoporous Films," 2010 NCCAVS CMPUG, San Jose, CA, April 28, 2010.
20.
T.-S. Kim and R. H. Dauskardt, "Molecular Diffusion under Nanometer Scale Confinement during CMP of Nanoporous Films," Materials Research Society Spring Meeting, San Francisco, CA, April 5-9, 2010.
19.
T.-S. Kim and R. H. Dauskardt, “Optimized CMP of Nanomaterials,” 215th Electrochemical Society Meeting, San Francisco, CA, May 24-29, 2009. (Invited)
18.
T.-S. Kim and R. H. Dauskardt, “Thermomechanical Reliability for Emerging Device Technologies: Implications for ULK Integration, 3-D Structures and Packaging,“ 2009 IEEE International Reliability Physics Symposium, Montreal, Canada, April 26-30, 2009. (Invited)
17.
T.-S. Kim, T. Konno, T. Yamanaka and R. H. Dauskardt, "Quantitative Roadmap for Optimizing CMP of Ultralow-k Dielectrics," Materials Research Society Spring Meeting, San Francisco, CA, April 14-17, 2009.
16.
T.-S. Kim, D. Chumakov, E. Zschech and R. H. Dauskardt, "Tuning UV Curing Depth Profiles for Optimal Mechanical Properties of Low-k Films," Materials Research Society Spring Meeting, San Francisco, CA, April 14-17, 2009.
15.
T.-S. Kim and R. H. Dauskardt, "Optimized CMP for Device Structure Containing Ultra-Low-k Dielectrics," SEMICON Korea, Seoul, Korea, Jan. 20-22, 2009.
14.
T.-S. Kim, N. Tsuji, J. van der Hilst, K. Matsushita, N. Kobayashi, D. Chumakov, H. Geisler, E. Zschech and R. H. Dauskardt, “Tuning Depth Profiles of Low-k Dielectrics with UV Curing,” Advanced Metallization Conference, San Diego, CA, 2008.
13.
T.-S. Kim, T. Konno, T. Yamanaka, and R. H. Dauskardt, “Optimizing CMP for Ultra-Low-k Dielectrics,” 13th International Chemical Mechanical Planarization Conference for ULSI Multilevel Interconnection, Fremont, CA, 2008.
12.
T.-S. Kim, T. Konno, T. Yamanaka, and R. H. Dauskardt, “Quantitative Roadmap for Optimizing CMP of Ultra-Low-k Dielectrics,” 2008 IEEE International Interconnect Technology Conference, Burlingame, CA, Jun. 1-4, 2008.
11.
T.-S. Kim, Q. Zhong, M. Peterson, H. Tam, T. Konno, and R. H. Dauskardt, “Stress and Solution Chemistry Effects for Optimized CMP of Ultra-Low-k Dielectrics,” Materials Research Society Spring Meeting, San Francisco, CA, Mar 24-27, 2008.
10.
T.-S. Kim, T. Konno, T. Yamanaka, and R. H. Dauskardt, “Optimizing CMP of Ultra-Low-k Dielectrics,” Proceedings of the 13th International Conference on Chemical-Mechanical Polish Planarization (CMP) for ULSI Multilevel Interconnection (CMP-MIC), pp. 21-26, Fremont, CA, Mar. 4-6, 2008.
9.
R. H. Dauskardt, T.-S. Kim, and M. Ong, "Optimized CMP of Ultra-Low-k Dielectrics," Levitronix CMP Users Conference 2008, Santa Clara, CA, Feb. 12, 2008.
8.
T.-S. Kim, N. Tsuji, N. Kemeling, K. Matsushita, N. Kobayashi, D. Chumakov, E. Zschech, and R. H. Dauskardt, “Depth Dependence of UV Curing of Organosilicate Low-k Thin Films,” Proceedings of Advanced Metallization Conference 2007, Albany, NY, Oct. 9-11, 2008.
7.
T.-S. Kim, Q. Zhong, M. Peterson, H. Tam, T. Konno, and R. H. Dauskardt, "Stress and Slurry Chemistry Effects on CMP Damage of Ultra-Low-k Dielectrics," 2007 IEEE International Interconnect Technology Conference Proceedings, pp. 129-131, Burlingame, CA, Jun. 4-6, 2007.
6.
T.-S. Kim, Q. Zhong, M. Peterson, H. Tam, T. Konno, and R. H. Dauskardt, "Optimizing Solution Chemistry for Reduced Damage during CMP," 2007 Materials Research Society Spring Meeting, San Francisco, CA, Apr. 9-13, 2007.
5.
R. H. Dauskardt, T.-S. Kim, Q. Zhong, M. Peterson, H. Tam, and T. Konno, "Stress and Slurry Chemistry Effects on Cracking and Damage Evolution during CMP: Implications for Next Technology Nodes," Proceedings of the 12th International Conference on Chemical-Mechanical Polish Planarization for ULSI Multilevel Interconnection (CMP-MIC), pp. 258-264, Fremont, CA, Mar. 5-8, 2007.
4.
R. H. Dauskardt, T.-S. Kim, Q. Zhong, M. Peterson, H. Tam, and T. Konno, “Solution Chemistry Effects on Cracking and Damage during CMP,” Levitronix CMP Users Conference 2007, Santa Clara, CA, Feb. 15, 2007.
3.
T.-S. Kim, N. Tsuji, N. Kemeling, K. Matsushita, and R. H. Dauskardt, "Non-Uniform UV Curing Effects on Mechanical and Fracture Properties of Organosilicate Low-k Thin Films," Proceedings of Advanced Metallization Conference 2006, pp. 389-394, San Diego, CA, Oct. 17-19, 2007.
2.
T.-S. Kim, Q. Zhong, M. Peterson, H. Tam, T. Konno, and R. H. Dauskardt, "Effects of CMP Slurry Surfactants on the Fracture of Nanoporous Low-k Dielectrics," 2006 International Conference on Planarization/CMP Technology, Foster City, CA, Oct. 12-13, 2006.
1.
Y. Park, W. Yoon, T.-S. Kim, C. Yoon, S. Kim, S. Lim, H. Park, J. Kim, J. Park, D. Han, and B. Cho, "Finding the Ideal Freezing Curve According to the Various Tissues with Indirect Thermophysical Calculation," The 9th International Conference on Tissue Banking, Asia Pacific Association of Surgical Tissue Banks, Seoul, Korea, 2002.