Our research group focuses on mechanics-related subjects of advanced packaging and thin films: adhesion, deformation, fracture, fatigue, reliability, and stress-strain-induced mutiphysics phenomena for the following applications.

Flexible display, fuel cell, solar cell, battery, electronic packaging, encapsulation, dry transfer, tensile / bending / folding / adhesion tests.

NEWS

2016.01.20 New Paper in ACS Nano